1、 Core process technology1. Precision lamination and interconnection processThe core of multi-layer PCB lies in interlayer alignment and bonding, and key technologies include:Laminated laminateMaterial stacking: The inner core board (copper-clad substrate) and the semi cured sheet (PP sheet) are al

1、 Core process technologyThe production process of single-sided PCB is simpler than that of laminated boards, but it requires precise control of key links to avoid defects:Basic process:Copper coated substrate cutting → graphic transfer (photochemical method or screen printing) → etching (removal o

1、 Core process technology1. Standard process (through-hole metallization process)Key technical points of the process, precision requirementsPreparation of FR-4/CEM-3/Aluminum Substrate Cutting → Copper Foil Thickness 1-2oz (35-70 μ m) Size Tolerance ± 0.15mmDrilling CNC mechanical drilling (apertur

1、Dimensional multi-layer circuit boardProcess steps: require 10+processes including inner layer graphic transfer, lamination alignment, laser drilling, hole metallization, etcAlignment accuracy: interlayer tolerance ≤ 75 μ m, dependent on temperature and humidity control and high-precision position

1、 Application differences classified by layers and structures1. Single panel (single-layer panel)Technical features: Only single-sided copper-clad, the substrate is mostly paper-based phenolic resin (such as 94HB/94V0) or composite substrate (CEM-1), with low cost but low wiring density.Typical app

OSP (Organic Solderability Preservative)Advantages:Low cost: Simple process, material cost is only 1/5 of gold plating.High flatness: Surface roughness <0.3μm, suitable for high-density SMT mounting.Environmental friendliness Does not contain heavy metals, complies with RoHS standards.Disadvantages:

Four-Layer Circuit Board (4-Layer)1. Layer StructureTypical stack-up:Layer → Prepreg → GND Layer → Core → PWR Layer → Prepreg → Bottom Layer(Top signal, ground, power, bottom signal). Core AdvantagesCost-effective: Compared to a double-sided board, adding a power/ground layer, the cost is only 50%~6

FR-4 (Glass fiber epoxy resin)Features:FR-4 is a glass fiber fabric reinforced epoxy resin with a medium dielectric constant (Dk 4.5-5.5), low dielectric loss (Df 0.02-0.03), high mechanical strength (bending strength ≥400 MPa), and UL94 V-0 flame retardancy.Advantages:Low cost: Material cost is 50%

Green: Most common, low cost; good UV light transmission, beneficial for exposure process; high contrast of lines, easy to detect defects.Black:earance is high-end, but low reflectivity, difficult for visual inspection; slightly higher heat absorption (extremely small impact on heat dissipation)Whit

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