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XRX-1014
DGXRX
1. Process Technology
The manufacturing process of double-sided FR-4 circuit boards follows standardized processes, mainly including the following key steps:
Base Material Preparation
The base material is FR-4 (epoxy resin bonded with electronic-grade glass fiber cloth), with copper foil (thickness typically ranging 1/2 oz to 15 oz, customizable up to 20 oz) laminated on the surface.
High-temperature and high-pressure lam ensure the mechanical strength and dimensional stability of the board.
Drilling and Hole Metalization
Mechanical drilling (with a minimum hole diameter of 0.15) is used to form through-holes (PTH, Plated Through Hole).
The chemical copper plating electroplating copper process is used to achieve electrical between layers, and the copper thickness on the hole wall must meet IPC standards (usually ≥20μm).
Image Transfer and Etching
Photithography process: coating photoresist → exposure → development, defining the circuit pattern.
Acid etching removes excess copper layers, forming precise conductors (with a line width/spacing of 75μm).
Solder Mask and Surface Treatment
Solder mask ink (optional colors include green, white, black etc.) is applied to protect non-soldering areas and prevent oxidation.
Surface treatment options include:
ENIG (Chemical Nickel Gold High flatness, suitable for precision solder joints;
HASL-LF (Lead-Free Spray Tin): Low cost, strong compatibility;
Immersion/Tin: Suitable for high-frequency signals.
Forming and Testing
CNC milling for shaping, V-cut for panel separation or stamping design for convenient assembly production.
Electrical test (ET), impedance control test ensures electrical reliability.
1. Process Technology
The manufacturing process of double-sided FR-4 circuit boards follows standardized processes, mainly including the following key steps:
Base Material Preparation
The base material is FR-4 (epoxy resin bonded with electronic-grade glass fiber cloth), with copper foil (thickness typically ranging 1/2 oz to 15 oz, customizable up to 20 oz) laminated on the surface.
High-temperature and high-pressure lam ensure the mechanical strength and dimensional stability of the board.
Drilling and Hole Metalization
Mechanical drilling (with a minimum hole diameter of 0.15) is used to form through-holes (PTH, Plated Through Hole).
The chemical copper plating electroplating copper process is used to achieve electrical between layers, and the copper thickness on the hole wall must meet IPC standards (usually ≥20μm).
Image Transfer and Etching
Photithography process: coating photoresist → exposure → development, defining the circuit pattern.
Acid etching removes excess copper layers, forming precise conductors (with a line width/spacing of 75μm).
Solder Mask and Surface Treatment
Solder mask ink (optional colors include green, white, black etc.) is applied to protect non-soldering areas and prevent oxidation.
Surface treatment options include:
ENIG (Chemical Nickel Gold High flatness, suitable for precision solder joints;
HASL-LF (Lead-Free Spray Tin): Low cost, strong compatibility;
Immersion/Tin: Suitable for high-frequency signals.
Forming and Testing
CNC milling for shaping, V-cut for panel separation or stamping design for convenient assembly production.
Electrical test (ET), impedance control test ensures electrical reliability.