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Circuit Board Manufacturing Process

  • Cutting Process

    Cut the large substrate material into small boards of appropriate size to prepare for subsequent processes.
  • Drilling Process

    According to the design documents, drill the required through holes on the substrate to connect the component pins to the copper foil.
  • Copper Plating Process

    By using the chemical copper plating method, a layer of copper foil is covered on the surface of the substrate and inside the via as a conductive layer. 
  • Drawing Process

    Transfer the designed circuit graphics onto the surface of copper foil through photolithography technology.
  • Etching Process

    Using chemical etching methods, remove unwanted copper foil parts to form the desired wire pattern.
  • Resistance Welding Process

    Coating solder mask material on the surface of copper foil to prevent short circuits during welding.
  • Character Process

    Print character ink on the circuit board, label component parameters, numbers, and other information.
  • Testing Process

    Strictly inspect the completed circuit board to ensure that its performance meets the design requirements.

Circuit Board Design

Design software
Use professional circuit board design software such as Altium Designer, Eagle, etc. for design.

Design specifications
Follow the design rules of the circuit board, such as wiring width, spacing, through-hole size, etc., to ensure stable performance of the circuit board.

Component layout
Reasonably arrange the layout of components to reduce signal interference and improve the overall performance of the circuit board.

Circuit Board Manufacturing Materials

Substrate material
The commonly used substrate materials include FR4, CEM-1, aluminum substrate, etc. When selecting, factors such as circuit board performance requirements and cost need to be considered.

Copper foil material
The wires on a circuit board are usually made of copper foil, and their thickness and surface treatment can affect the conductivity and corrosion resistance of the circuit board.

Solder resist materials and character ink
Solder resistant materials are used to prevent short circuits in copper foil during the welding process, and character ink is used to label information such as component parameters and numbers.

Customized Services

We provide customized services to design and produce circuit boards according to customer needs.

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