Blogs

1、 Core process technology1. Standard process (through-hole metallization process)Key technical points of the process, precision requirementsPreparation of FR-4/CEM-3/Aluminum Substrate Cutting → Copper Foil Thickness 1-2oz (35-70 μ m) Size Tolerance ± 0.15mmDrilling CNC mechanical drilling (apertur

1、Dimensional multi-layer circuit boardProcess steps: require 10+processes including inner layer graphic transfer, lamination alignment, laser drilling, hole metallization, etcAlignment accuracy: interlayer tolerance ≤ 75 μ m, dependent on temperature and humidity control and high-precision position

1、 Application differences classified by layers and structures1. Single panel (single-layer panel)Technical features: Only single-sided copper-clad, the substrate is mostly paper-based phenolic resin (such as 94HB/94V0) or composite substrate (CEM-1), with low cost but low wiring density.Typical app

Four-Layer Circuit Board (4-Layer)1. Layer StructureTypical stack-up:Layer → Prepreg → GND Layer → Core → PWR Layer → Prepreg → Bottom Layer(Top signal, ground, power, bottom signal). Core AdvantagesCost-effective: Compared to a double-sided board, adding a power/ground layer, the cost is only 50%~6

FR-4 (Glass fiber epoxy resin)Features:FR-4 is a glass fiber fabric reinforced epoxy resin with a medium dielectric constant (Dk 4.5-5.5), low dielectric loss (Df 0.02-0.03), high mechanical strength (bending strength ≥400 MPa), and UL94 V-0 flame retardancy.Advantages:Low cost: Material cost is 50%