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OSP (Organic Solderability Preservative)Advantages:Low cost: Simple process, material cost is only 1/5 of gold plating.High flatness: Surface roughness <0.3μm, suitable for high-density SMT mounting.Environmental friendliness Does not contain heavy metals, complies with RoHS standards.Disadvantages:
READ MORE Four-Layer Circuit Board (4-Layer)1. Layer StructureTypical stack-up:Layer → Prepreg → GND Layer → Core → PWR Layer → Prepreg → Bottom Layer(Top signal, ground, power, bottom signal). Core AdvantagesCost-effective: Compared to a double-sided board, adding a power/ground layer, the cost is only 50%~6
READ MORE FR-4 (Glass fiber epoxy resin)Features:FR-4 is a glass fiber fabric reinforced epoxy resin with a medium dielectric constant (Dk 4.5-5.5), low dielectric loss (Df 0.02-0.03), high mechanical strength (bending strength ≥400 MPa), and UL94 V-0 flame retardancy.Advantages:Low cost: Material cost is 50%
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Green: Most common, low cost; good UV light transmission, beneficial for exposure process; high contrast of lines, easy to detect defects.Black:earance is high-end, but low reflectivity, difficult for visual inspection; slightly higher heat absorption (extremely small impact on heat dissipation)Whit
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