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1、 Core process technology1. Precision lamination and interconnection processThe core of multi-layer PCB lies in interlayer alignment and bonding, and key technologies include:Laminated laminateMaterial stacking: The inner core board (copper-clad substrate) and the semi cured sheet (PP sheet) are al
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1、 Core process technologyThe production process of single-sided PCB is simpler than that of laminated boards, but it requires precise control of key links to avoid defects:Basic process:Copper coated substrate cutting → graphic transfer (photochemical method or screen printing) → etching (removal o
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1、 Core process technology1. Standard process (through-hole metallization process)Key technical points of the process, precision requirementsPreparation of FR-4/CEM-3/Aluminum Substrate Cutting → Copper Foil Thickness 1-2oz (35-70 μ m) Size Tolerance ± 0.15mmDrilling CNC mechanical drilling (apertur
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1、Dimensional multi-layer circuit boardProcess steps: require 10+processes including inner layer graphic transfer, lamination alignment, laser drilling, hole metallization, etcAlignment accuracy: interlayer tolerance ≤ 75 μ m, dependent on temperature and humidity control and high-precision position
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