OSP (Organic Solderability Preservative)Advantages:Low cost: Simple process, material cost is only 1/5 of gold plating.High flatness: Surface roughness <0.3μm, suitable for high-density SMT mounting.Environmental friendliness Does not contain heavy metals, complies with RoHS standards.Disadvantages:

Four-Layer Circuit Board (4-Layer)1. Layer StructureTypical stack-up:Layer → Prepreg → GND Layer → Core → PWR Layer → Prepreg → Bottom Layer(Top signal, ground, power, bottom signal). Core AdvantagesCost-effective: Compared to a double-sided board, adding a power/ground layer, the cost is only 50%~6

FR-4 (Glass fiber epoxy resin)Features:FR-4 is a glass fiber fabric reinforced epoxy resin with a medium dielectric constant (Dk 4.5-5.5), low dielectric loss (Df 0.02-0.03), high mechanical strength (bending strength ≥400 MPa), and UL94 V-0 flame retardancy.Advantages:Low cost: Material cost is 50%

Green: Most common, low cost; good UV light transmission, beneficial for exposure process; high contrast of lines, easy to detect defects.Black:earance is high-end, but low reflectivity, difficult for visual inspection; slightly higher heat absorption (extremely small impact on heat dissipation)Whit

In today’s fast-paced technological world, having a reliable and high-performance PCB (Printed Circuit Board) is crucial to ensure the functionality and longevity of electronic devices. Our custom PCB solutions are tailored to meet the needs of industries ranging from high-end power supplies to audi