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XRX-10295
DGXRX
Detailed explanation of core process technology
1. Standard process (through-hole metallization process)
Key technical points of the process, precision requirements
Preparation of FR-4 epoxy board for substrate cutting (Tg ≥ 130 ℃), copper foil thickness 1-2oz (35-70 μ m), size tolerance ± 0.15mm
Drilling CNC mechanical drilling (aperture ≥ 0.3mm) → plasma debonding slag hole position accuracy ± 0.05mm
Hole metallization PTH (copper electroplating):
Chemical deposition of copper (0.5 μ m) → full plate electroplating (hole copper ≥ 20 μ m) with a depth to diameter ratio of ≤ 8:1
Double sided LDI exposure for graphic transfer → graphic electroplating (copper+tin protection) → alkaline etching to remove film with a line width tolerance of ± 0.07mm
Solder mask and surface treatment spray solder mask ink (green oil) → character printing → HASL/ENIG/OSP three choice solder mask bridge width ≥ 0.1mm
2. Advanced technology (high reliability requirement)
Resin plug hole: Fill the through-hole with epoxy resin to prevent welding short circuit (mandatory requirement for automotive electronics).
Selective gold plating: ENIG immersion in contact area (corrosion-resistant), OSP treatment in welding area (cost reduction of 30%).
2oz thick copper design: The outer layer is etched with thickened copper foil, supporting 10A high current power modules.
Five core advantages of FR-4 double-sided board
1. Electrical and mechanical performance
Indicator FR-4: Double panel performance compared to single panel improvement
The density of double-sided wiring and through-hole jumper components has been increased by 80% in terms of wiring density
Signal integrity impedance control ± 8% (below 500MHz) crosstalk reduction of 25%
Heat dissipation capability: double-sided copper plating+thermal conductivity via reduces thermal resistance by 35% (equivalent power consumption, temperature drop of 12 ℃)
Reliability meets IPC-6012 CLASS 2 standard and can withstand 100000 thermal cycles (-55 ℃~125 ℃)
Structural strength: Glass fiber reinforced flexural strength>400MPa, twice as high as paper substrate strength
2. Economic advantages
Cost efficiency ratio: 40-60% lower in cost than 4-layer boards, supporting medium complexity circuits such as MCU systems.
Production cycle: Batch delivery takes 3-4 days (30% faster than multi-layer boards).
Convenient maintenance: Through hole light transmission detection for faults, with a repair success rate of over 90%.
Application Fields and Typical Cases
1. Consumer electronics (accounting for 45%)
Product type, technical solution, performance highlights
Smart home controller with 2oz copper thickness and OSP processing supports WiFi/BLE dual-mode communication
Mobile power bank motherboard thick copper design+resin plug hole continuous output 10A current, temperature rise<40 ℃
Unmanned aerial vehicle tuning module FR-4 Tg150 ℃+high TG solder resist vibration resistance 20G, stable operation at an altitude of 3000 meters
2. Industrial control (accounting for 35%)
PLC system:
I/O interface board (double-sided grounded shielding, anti EMI interference)
Motor driver (aluminum based embedded heat dissipation, supporting 5A/380V)
Industrial sensors:
Temperature and humidity transmitter (-40 ℃~85 ℃ full temperature range accuracy ± 2%)
Automotive electronics (accounting for 15%)
Application scenario technical solution vehicle specification certification
Window control module FR-4 Tg150 ℃+ENIG passed ISO-16750 vibration test
LED car light driver aluminum substrate local heat dissipation+2oz copper thickness resistant to 85 ℃ engine compartment environment
Car charger (OBC) resin plug hole+three proof paint coating meets AEC-Q200 reliability standard
Emerging fields
IoT edge node: LoRa module (double-sided antenna design, transmission distance of 2km).
Education development board: Raspberry Pi expansion board (through-hole compatible with breadline jumper).
Process limitations and solutions
Effect of defect solution
High frequency loss>500MHz circuit switching to high-frequency substrate (RO4350B mixed voltage) reduces insertion loss from>2dB to< 0.5dB@1GHz
Inter layer interference increases, grounding via (spacing λ/10) reduces EMI by 15dB μ V
Welding virtual soldering step reflow soldering curve+nitrogen protection virtual soldering rate reduced from 3% to 0.5%
Detailed explanation of core process technology
1. Standard process (through-hole metallization process)
Key technical points of the process, precision requirements
Preparation of FR-4 epoxy board for substrate cutting (Tg ≥ 130 ℃), copper foil thickness 1-2oz (35-70 μ m), size tolerance ± 0.15mm
Drilling CNC mechanical drilling (aperture ≥ 0.3mm) → plasma debonding slag hole position accuracy ± 0.05mm
Hole metallization PTH (copper electroplating):
Chemical deposition of copper (0.5 μ m) → full plate electroplating (hole copper ≥ 20 μ m) with a depth to diameter ratio of ≤ 8:1
Double sided LDI exposure for graphic transfer → graphic electroplating (copper+tin protection) → alkaline etching to remove film with a line width tolerance of ± 0.07mm
Solder mask and surface treatment spray solder mask ink (green oil) → character printing → HASL/ENIG/OSP three choice solder mask bridge width ≥ 0.1mm
2. Advanced technology (high reliability requirement)
Resin plug hole: Fill the through-hole with epoxy resin to prevent welding short circuit (mandatory requirement for automotive electronics).
Selective gold plating: ENIG immersion in contact area (corrosion-resistant), OSP treatment in welding area (cost reduction of 30%).
2oz thick copper design: The outer layer is etched with thickened copper foil, supporting 10A high current power modules.
Five core advantages of FR-4 double-sided board
1. Electrical and mechanical performance
Indicator FR-4: Double panel performance compared to single panel improvement
The density of double-sided wiring and through-hole jumper components has been increased by 80% in terms of wiring density
Signal integrity impedance control ± 8% (below 500MHz) crosstalk reduction of 25%
Heat dissipation capability: double-sided copper plating+thermal conductivity via reduces thermal resistance by 35% (equivalent power consumption, temperature drop of 12 ℃)
Reliability meets IPC-6012 CLASS 2 standard and can withstand 100000 thermal cycles (-55 ℃~125 ℃)
Structural strength: Glass fiber reinforced flexural strength>400MPa, twice as high as paper substrate strength
2. Economic advantages
Cost efficiency ratio: 40-60% lower in cost than 4-layer boards, supporting medium complexity circuits such as MCU systems.
Production cycle: Batch delivery takes 3-4 days (30% faster than multi-layer boards).
Convenient maintenance: Through hole light transmission detection for faults, with a repair success rate of over 90%.
Application Fields and Typical Cases
1. Consumer electronics (accounting for 45%)
Product type, technical solution, performance highlights
Smart home controller with 2oz copper thickness and OSP processing supports WiFi/BLE dual-mode communication
Mobile power bank motherboard thick copper design+resin plug hole continuous output 10A current, temperature rise<40 ℃
Unmanned aerial vehicle tuning module FR-4 Tg150 ℃+high TG solder resist vibration resistance 20G, stable operation at an altitude of 3000 meters
2. Industrial control (accounting for 35%)
PLC system:
I/O interface board (double-sided grounded shielding, anti EMI interference)
Motor driver (aluminum based embedded heat dissipation, supporting 5A/380V)
Industrial sensors:
Temperature and humidity transmitter (-40 ℃~85 ℃ full temperature range accuracy ± 2%)
Automotive electronics (accounting for 15%)
Application scenario technical solution vehicle specification certification
Window control module FR-4 Tg150 ℃+ENIG passed ISO-16750 vibration test
LED car light driver aluminum substrate local heat dissipation+2oz copper thickness resistant to 85 ℃ engine compartment environment
Car charger (OBC) resin plug hole+three proof paint coating meets AEC-Q200 reliability standard
Emerging fields
IoT edge node: LoRa module (double-sided antenna design, transmission distance of 2km).
Education development board: Raspberry Pi expansion board (through-hole compatible with breadline jumper).
Process limitations and solutions
Effect of defect solution
High frequency loss>500MHz circuit switching to high-frequency substrate (RO4350B mixed voltage) reduces insertion loss from>2dB to< 0.5dB@1GHz
Inter layer interference increases, grounding via (spacing λ/10) reduces EMI by 15dB μ V
Welding virtual soldering step reflow soldering curve+nitrogen protection virtual soldering rate reduced from 3% to 0.5%