Differences in the application fields of different types of circuit boards

1、 Application differences classified by layers and structures
1. Single panel (single-layer panel)
Technical features: Only single-sided copper-clad, the substrate is mostly paper-based phenolic resin (such as 94HB/94V0) or composite substrate (CEM-1), with low cost but low wiring density.

Typical applications:

Consumer electronics: remote control, simple small appliance control board (such as rice cooker timer) 17.

Lighting: LED desk lamp driver board (94V0 flame-retardant paper substrate ensures safety).

Core advantage: Extremely low cost (more than 30% lower than FR-4), suitable for large-scale standardized production.

2. Double sided panel
Technical features: Double sided copper-clad+metalized via (PTH), with FR-4 as the main substrate, supporting medium wiring density.

Typical applications:

Industrial control: PLC interface board, sensor signal conditioning circuit.

Automotive electronics: car audio motherboard, central control screen driver board (temperature resistant to -40 ℃~85 ℃).

Core advantages: Balancing cost and performance, compatible with lead-free soldering, strong vibration resistance.

3. Multilayer board (≥ 4 layers)
Technical features: Stacked conductive layers (8-64 layers), including blind buried hole design, substrate made of high-speed FR-4 or special resin.

Typical applications:

Server/Data Center: AI server motherboard (16 layers or above, supporting CPU/GPU high-speed interconnection).

Communication equipment: 5G base station BBU board (impedance control ± 5% required).

High end consumer electronics: smartphone motherboard (10 layer 3-level HDI, line width ≤ 0.06mm).

Core advantages: high-density wiring, excellent signal integrity (reducing crosstalk), integrated heat dissipation layer.