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XRX-102884
DGXRX
1、 Manufacturing process of FR-4 double-sided circuit board
The manufacturing process of FR-4 double-sided circuit board is more complex than that of single panel, and the core lies in double-sided wiring and interlayer conduction technology. The main steps are as follows:
Cutting materials
Cut the FR-4 copper-clad substrate (glass fiber reinforced epoxy resin laminated board) into the required size.
drill
Drill holes on the substrate using mechanical or laser drills for subsequent metallization via (PTH) to achieve interlayer connections; The minimum aperture can reach Φ 0.2mm.
Chemical Copper Deposition (PTH) and Electroplating
Chemical copper deposition: depositing a layer of conductive copper on the pore wall to ensure electrical connectivity;
Electroplating thickening: By electroplating, the copper layer is thickened to 5-30 μ m to enhance conductivity and mechanical strength.
Pattern Transfer
Coating photosensitive film, transferring circuit patterns onto copper foil through exposure and development, preparing for etching.
Graphic electroplating and etching
Secondary electroplating: Tin plating is used as a protective layer on circuit graphics;
Etching: Remove the unprotected copper layer with an acidic solution to form a precise circuit with a minimum line width/spacing of 0.1mm.
Solder mask and character printing
Cover with solder mask ink (green, black, blue, etc.) to protect non welding areas; Print white/black characters to indicate the position of components.
Surface Treatment
Optional processes include:
Tin spraying (hot air leveling): Low cost, good weldability;
Sinking gold/silver: improves corrosion resistance and welding accuracy, suitable for high-density mounting.
Forming and Testing
Use V-cut or milling machine to cut the shape, and conduct reliability verification such as open/short circuit testing and thermal shock testing (288 ℃ for 10 seconds).
Key Process Comparison (Traditional vs. Modern Technology):
Advantages of modern improvement of traditional technology in process steps
Interlayer conductive chemical copper deposition+electroplating laser drilling+pulse electroplating hole wall more uniform, yield improvement
Graphic accuracy: The minimum line width of wet film is 0.2mm. Laser direct imaging (LDI) has a minimum line width of 0.1mm
Environmentally friendly use of acidic etching solution for cyanide free copper deposition and lead-free tin spraying to reduce heavy metal pollution
2、 The core advantages of FR-4 double-sided circuit board
Excellent electrical performance
Low signal loss: Stable dielectric constant (about 4.5), low dielectric loss, suitable for high-frequency signal transmission (such as 5G modules, RF equipment).
Strong anti-interference ability: Double sided wiring reduces cross interference, via technology optimizes current path, and data transmission efficiency is 30% higher than single panel.
High mechanical and thermal stability
Strength: The bending strength of the glass fiber reinforced structure is ≥ 1.6Kv/mm, the peel strength is 1.5N/mm, and it is resistant to mechanical vibration;
Heat resistance: The working temperature can reach 130 ° C-180 ° C, and it has passed the 288 ° C thermal shock test, making it suitable for high temperature environments such as automotive engine compartments.
Cost and production efficiency advantages
FR-4 substrate has a moderate price and standardized processes such as punching and V-cutting support large-area processing (up to 600mm × 600mm), making it suitable for large-scale production.
Safety and Environmental Protection
Compliant with UL94 V-0 flame retardant standard, self extinguishing in case of fire; Modern technology adopts lead-free soldering and environmentally friendly ink to reduce pollution.
3、 Application Fields
FR-4 dual panel is widely used in the following fields due to its high double-sided wiring density and strong stability:
communication devices
Base station antenna/router: High frequency signal transmission requirements, minimum line width of 0.1mm to ensure signal integrity;
Bluetooth module: Double sided mounting components reduce size and adapt to compact design of smart devices.
Automotive Electronics
ECU control unit: high temperature resistance and anti vibration characteristics ensure the reliability of the engine management system;
Sensor: Dual sided layout supports complex signal acquisition circuits (such as tire pressure monitoring).
Industrial Control and Power Supply
Power module: Thick copper design (copper foil 2-3oz) supports high current carrying, combined with aluminum substrate to enhance heat dissipation;
Instrumentation: Anti stripping strength ensures long-term stability in industrial environments.
Consumer Electronics
Smartphones/gaming consoles: Improve data transmission stability and avoid high load overheating;
LED lighting: Double sided wiring optimizes the driving circuit, extending the lifespan of the lighting fixtures.
medical equipment
Portable monitor: flame retardant properties meet medical safety standards, and the immersion gold process ensures welding reliability.
4、 Future Development Trends
High frequency upgrade
Modified epoxy resin (such as low Dk/Df formula) supports millimeter wave frequency band and is suitable for 5G/6G communication needs.
green manufacturing
Promote halogen-free substrates and recyclable processes to reduce carbon footprint.
Integration and miniaturization
Combining HDI (high-density interconnect) technology to achieve blind buried hole and micro hole design, further reducing board size.
1、 Manufacturing process of FR-4 double-sided circuit board
The manufacturing process of FR-4 double-sided circuit board is more complex than that of single panel, and the core lies in double-sided wiring and interlayer conduction technology. The main steps are as follows:
Cutting materials
Cut the FR-4 copper-clad substrate (glass fiber reinforced epoxy resin laminated board) into the required size.
drill
Drill holes on the substrate using mechanical or laser drills for subsequent metallization via (PTH) to achieve interlayer connections; The minimum aperture can reach Φ 0.2mm.
Chemical Copper Deposition (PTH) and Electroplating
Chemical copper deposition: depositing a layer of conductive copper on the pore wall to ensure electrical connectivity;
Electroplating thickening: By electroplating, the copper layer is thickened to 5-30 μ m to enhance conductivity and mechanical strength.
Pattern Transfer
Coating photosensitive film, transferring circuit patterns onto copper foil through exposure and development, preparing for etching.
Graphic electroplating and etching
Secondary electroplating: Tin plating is used as a protective layer on circuit graphics;
Etching: Remove the unprotected copper layer with an acidic solution to form a precise circuit with a minimum line width/spacing of 0.1mm.
Solder mask and character printing
Cover with solder mask ink (green, black, blue, etc.) to protect non welding areas; Print white/black characters to indicate the position of components.
Surface Treatment
Optional processes include:
Tin spraying (hot air leveling): Low cost, good weldability;
Sinking gold/silver: improves corrosion resistance and welding accuracy, suitable for high-density mounting.
Forming and Testing
Use V-cut or milling machine to cut the shape, and conduct reliability verification such as open/short circuit testing and thermal shock testing (288 ℃ for 10 seconds).
Key Process Comparison (Traditional vs. Modern Technology):
Advantages of modern improvement of traditional technology in process steps
Interlayer conductive chemical copper deposition+electroplating laser drilling+pulse electroplating hole wall more uniform, yield improvement
Graphic accuracy: The minimum line width of wet film is 0.2mm. Laser direct imaging (LDI) has a minimum line width of 0.1mm
Environmentally friendly use of acidic etching solution for cyanide free copper deposition and lead-free tin spraying to reduce heavy metal pollution
2、 The core advantages of FR-4 double-sided circuit board
Excellent electrical performance
Low signal loss: Stable dielectric constant (about 4.5), low dielectric loss, suitable for high-frequency signal transmission (such as 5G modules, RF equipment).
Strong anti-interference ability: Double sided wiring reduces cross interference, via technology optimizes current path, and data transmission efficiency is 30% higher than single panel.
High mechanical and thermal stability
Strength: The bending strength of the glass fiber reinforced structure is ≥ 1.6Kv/mm, the peel strength is 1.5N/mm, and it is resistant to mechanical vibration;
Heat resistance: The working temperature can reach 130 ° C-180 ° C, and it has passed the 288 ° C thermal shock test, making it suitable for high temperature environments such as automotive engine compartments.
Cost and production efficiency advantages
FR-4 substrate has a moderate price and standardized processes such as punching and V-cutting support large-area processing (up to 600mm × 600mm), making it suitable for large-scale production.
Safety and Environmental Protection
Compliant with UL94 V-0 flame retardant standard, self extinguishing in case of fire; Modern technology adopts lead-free soldering and environmentally friendly ink to reduce pollution.
3、 Application Fields
FR-4 dual panel is widely used in the following fields due to its high double-sided wiring density and strong stability:
communication devices
Base station antenna/router: High frequency signal transmission requirements, minimum line width of 0.1mm to ensure signal integrity;
Bluetooth module: Double sided mounting components reduce size and adapt to compact design of smart devices.
Automotive Electronics
ECU control unit: high temperature resistance and anti vibration characteristics ensure the reliability of the engine management system;
Sensor: Dual sided layout supports complex signal acquisition circuits (such as tire pressure monitoring).
Industrial Control and Power Supply
Power module: Thick copper design (copper foil 2-3oz) supports high current carrying, combined with aluminum substrate to enhance heat dissipation;
Instrumentation: Anti stripping strength ensures long-term stability in industrial environments.
Consumer Electronics
Smartphones/gaming consoles: Improve data transmission stability and avoid high load overheating;
LED lighting: Double sided wiring optimizes the driving circuit, extending the lifespan of the lighting fixtures.
medical equipment
Portable monitor: flame retardant properties meet medical safety standards, and the immersion gold process ensures welding reliability.
4、 Future Development Trends
High frequency upgrade
Modified epoxy resin (such as low Dk/Df formula) supports millimeter wave frequency band and is suitable for 5G/6G communication needs.
green manufacturing
Promote halogen-free substrates and recyclable processes to reduce carbon footprint.
Integration and miniaturization
Combining HDI (high-density interconnect) technology to achieve blind buried hole and micro hole design, further reducing board size.