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XRX-10265
DGXRX
1、 Core process technology
1. Substrate and structural characteristics
Material composition: 94V0 belongs to flame-retardant paper substrate, with a core layer of cotton fiber paper impregnated with flame-retardant epoxy resin (containing bromine/phosphorus flame retardants), double-sided electrolytic copper foil (conventional 1oz/35 μ m), and UL 94 V-0 certification (self extinguishing within 10 seconds of vertical combustion).
Processing restrictions:
Only supports mechanical drilling (minimum aperture 0.4mm), cannot laser drill micro holes (paper-based materials are prone to carbonization);
The thickness range is 0.8-2.0mm, and it is recommended to be above 1.6mm to reduce the risk of deformation in the soldering furnace.
2. Key Process Flow
Special requirements for process technology key points
Graphic transfer screen printing with corrosion-resistant ink (line width ≥ 0.2mm), replacing LDI exposure to reduce costs, side etching control ≤ 15 μ m, accuracy lower than FR-4
Chemical copper deposition with hole metallization+full plate electroplating (hole copper ≥ 20 μ m), resin plug hole (paper-based not resistant to strong acids) depth to diameter ratio ≤ 6:1 is prohibited to avoid hole wall tearing
Surface treatment with tin spraying (HASL) as the main method (with the lowest cost), temperature ≤ 285 ℃/time ≤ 5 seconds, to prevent copper foil foaming. 2. Lead free tin spraying requires strict temperature control (tin furnace operation specifications)
Solder mask and forming silk screen green solder mask oil (hardness>5H), die punching or V-cutting forming (angle 30 °/45 °) V-cutting depth is 2/3 of the plate thickness, anti fracture
3. Technological challenges and countermeasures
Deformation of tin furnace:
Root cause: Poor heat resistance of paper-based materials (Tg ≈ 105 ℃), and easy delamination at high temperatures;
Solution: Pre drying board (120 ℃/2 hours dehumidification), tin furnace temperature 260-285 ℃, transfer speed ≥ 1.2m/min.
Welding explosion plate:
Adding elastomer modified resin enhances bending strength (>200MPa), which is 40% higher than the standard 94V0.
2、 Core advantage: The ultimate balance between cost and flame retardancy
1. Performance comparison (vs FR-4 double-sided board)
Indicator 94V0 double-sided board FR-4 double-sided board advantages/limitations
Cost ¥ 20-30/㎡ (minimum) ¥ 50-80/㎡ ↓ 60% material cost
Flame retardant UL 94 V-0 certification (10 second self extinguishing) UL 94 V-0 equivalent meets basic safety requirements
Processing efficiency supports die forming (efficiency up to 50%), requiring mechanical drilling suitable for large-scale production
Environmentally friendly paper-based biodegradable, copper recovery rate>90%, difficult to recycle fiberglass in compliance with RoHS directive
Maximum frequency ≤ 100MHz ≤ 500MHz, limited to low-frequency scenarios only
2. Irreplaceability advantage
Delivery speed: Urgent sample delivery within 24 hours, batch cycle of 3-4 days (FR-4 takes 5-7 days);
Vibration reduction performance: Paper based vibration absorption characteristics are superior to fiberglass, with an industrial vibration environment failure rate of ↓ 30%.
3、 Application area: Low cost and reliable scenarios
1. Consumer electronics (accounting for 70%)
The power adapter:
Mobile phone charger control board (cost<￥ 1/piece), with a thickness of 1.6mm and no deformation after passing through a tin furnace;
Home appliance control board:
Electric fan timer, remote control (double-sided wiring simplified jumper), mold punching process supports monthly production of 20000 square meters.
2. Industrial control (accounting for 25%)
Performance verification of application scenario technical solutions
Relay module OSP processing+local 2oz thick copper resistant to 100000 insertions and removals (IEC 60664)
Temperature and humidity sensors are widely covered with copper for heat dissipation, operating in the full temperature range of -40 ℃~85 ℃
3. Automotive Electronics (Special Adaptation)
Low voltage non safety module: window switch, seat heater (requires pre drying explosion-proof board);
Disabled scenario: ECU/ABS and other high-frequency high-temperature systems (paper-based temperature resistance limitations).
⚠️ 4、 Limitations and alternative solutions
Root cause upgrade plan for defects
High frequency loss caused by large paper fiber leads to Dk fluctuation of ± 0.5 (@ 1GHz)>100MHz, switch to CEM-3/FR-4
Layer limit: Low compressive strength of paper-based material>2 layers, CEM-3 composite material needs to be replaced
Moisture and heat resistance, water absorption rate>0.5%, three proof paint coating+pre baked board
1、 Core process technology
1. Substrate and structural characteristics
Material composition: 94V0 belongs to flame-retardant paper substrate, with a core layer of cotton fiber paper impregnated with flame-retardant epoxy resin (containing bromine/phosphorus flame retardants), double-sided electrolytic copper foil (conventional 1oz/35 μ m), and UL 94 V-0 certification (self extinguishing within 10 seconds of vertical combustion).
Processing restrictions:
Only supports mechanical drilling (minimum aperture 0.4mm), cannot laser drill micro holes (paper-based materials are prone to carbonization);
The thickness range is 0.8-2.0mm, and it is recommended to be above 1.6mm to reduce the risk of deformation in the soldering furnace.
2. Key Process Flow
Special requirements for process technology key points
Graphic transfer screen printing with corrosion-resistant ink (line width ≥ 0.2mm), replacing LDI exposure to reduce costs, side etching control ≤ 15 μ m, accuracy lower than FR-4
Chemical copper deposition with hole metallization+full plate electroplating (hole copper ≥ 20 μ m), resin plug hole (paper-based not resistant to strong acids) depth to diameter ratio ≤ 6:1 is prohibited to avoid hole wall tearing
Surface treatment with tin spraying (HASL) as the main method (with the lowest cost), temperature ≤ 285 ℃/time ≤ 5 seconds, to prevent copper foil foaming. 2. Lead free tin spraying requires strict temperature control (tin furnace operation specifications)
Solder mask and forming silk screen green solder mask oil (hardness>5H), die punching or V-cutting forming (angle 30 °/45 °) V-cutting depth is 2/3 of the plate thickness, anti fracture
3. Technological challenges and countermeasures
Deformation of tin furnace:
Root cause: Poor heat resistance of paper-based materials (Tg ≈ 105 ℃), and easy delamination at high temperatures;
Solution: Pre drying board (120 ℃/2 hours dehumidification), tin furnace temperature 260-285 ℃, transfer speed ≥ 1.2m/min.
Welding explosion plate:
Adding elastomer modified resin enhances bending strength (>200MPa), which is 40% higher than the standard 94V0.
2、 Core advantage: The ultimate balance between cost and flame retardancy
1. Performance comparison (vs FR-4 double-sided board)
Indicator 94V0 double-sided board FR-4 double-sided board advantages/limitations
Cost ¥ 20-30/㎡ (minimum) ¥ 50-80/㎡ ↓ 60% material cost
Flame retardant UL 94 V-0 certification (10 second self extinguishing) UL 94 V-0 equivalent meets basic safety requirements
Processing efficiency supports die forming (efficiency up to 50%), requiring mechanical drilling suitable for large-scale production
Environmentally friendly paper-based biodegradable, copper recovery rate>90%, difficult to recycle fiberglass in compliance with RoHS directive
Maximum frequency ≤ 100MHz ≤ 500MHz, limited to low-frequency scenarios only
2. Irreplaceability advantage
Delivery speed: Urgent sample delivery within 24 hours, batch cycle of 3-4 days (FR-4 takes 5-7 days);
Vibration reduction performance: Paper based vibration absorption characteristics are superior to fiberglass, with an industrial vibration environment failure rate of ↓ 30%.
3、 Application area: Low cost and reliable scenarios
1. Consumer electronics (accounting for 70%)
The power adapter:
Mobile phone charger control board (cost<￥ 1/piece), with a thickness of 1.6mm and no deformation after passing through a tin furnace;
Home appliance control board:
Electric fan timer, remote control (double-sided wiring simplified jumper), mold punching process supports monthly production of 20000 square meters.
2. Industrial control (accounting for 25%)
Performance verification of application scenario technical solutions
Relay module OSP processing+local 2oz thick copper resistant to 100000 insertions and removals (IEC 60664)
Temperature and humidity sensors are widely covered with copper for heat dissipation, operating in the full temperature range of -40 ℃~85 ℃
3. Automotive Electronics (Special Adaptation)
Low voltage non safety module: window switch, seat heater (requires pre drying explosion-proof board);
Disabled scenario: ECU/ABS and other high-frequency high-temperature systems (paper-based temperature resistance limitations).
⚠️ 4、 Limitations and alternative solutions
Root cause upgrade plan for defects
High frequency loss caused by large paper fiber leads to Dk fluctuation of ± 0.5 (@ 1GHz)>100MHz, switch to CEM-3/FR-4
Layer limit: Low compressive strength of paper-based material>2 layers, CEM-3 composite material needs to be replaced
Moisture and heat resistance, water absorption rate>0.5%, three proof paint coating+pre baked board