Comparison of Process Advantages between Multi-layer Circuit Boards And Single-sided Circuit Boards

1、Dimensional multi-layer circuit board
Process steps: require 10+processes including inner layer graphic transfer, lamination alignment, laser drilling, hole metallization, etc
Alignment accuracy: interlayer tolerance ≤ 75 μ m, dependent on temperature and humidity control and high-precision positioning system
Production cycle: Batch production takes 5-7 days (lamination/perforation time)
Yield control: X-ray/AOI detection is required for inner layer defects, and yield is affected by the number of layers

Single sided circuit board
Process steps: Only basic processes such as cutting, etching, drilling, and surface treatment are required
Alignment accuracy: No interlayer alignment requirement, loose tolerance requirement (± 0.1mm level)
Production cycle: Urgent delivery within 24 hours, batch lead time 3-4 days
Yield control: visual inspection+flying needle testing is sufficient, yield>99%

2、 Cost and Economic Comparison
Cost disadvantage of multi-layer board:
High material cost: requires high-frequency substrates (such as PTFE), semi cured sheets (PP sheets), and thick copper foils;
Large equipment investment: relying on precision equipment such as LDI lithography machines and vacuum laminating machines;
High design cost: Complex impedance control requires professional EDA tools and simulations.
The total cost is 30-50% higher than that of a single panel, and the cost of a 32 layer board can reach 5 times that of a single panel.
Single panel cost advantage:
Simple substrate: paper-based (22F) or FR-1 is sufficient, with low raw material costs;
No lamination/perforation steps: saving energy consumption and labor hours;
Easy maintenance: fast fault location, low cost of component replacement.

3、Comparison of Electrical and Mechanical Performance

Advantages of multi-layer board
Signal integrity: dedicated grounding layer+differential distribution line, reducing high-frequency insertion loss by 15%
Electromagnetic compatibility: power supply/ground shielding radiation, passed automotive electronic EMC testing
Heat dissipation capability: Aluminum substrate thermal resistance reduced by 40% (such as IGBT modules for new energy vehicles)
Structural strength: The laminated structure is resistant to mechanical stress and has passed 100000 thermal cycle tests

Single panel limitations
Signal integrity: Jumpers are prone to introduce interference, and significant signal distortion occurs when the frequency exceeds 100MHz
Electromagnetic compatibility: No shielding layer, weak anti-interference ability
Heat dissipation capability: dependent on external heat sinks, prone to failure in high temperature scenarios
Structural strength: Single layer substrate is prone to bending and deformation.

4、 Applicable scenarios and design flexibility
Multilayer board:
High density integration: The line width/spacing of the smartphone HDI board reaches 2.5mil, and the volume is 70% smaller than that of a single panel
Complex system: supports 20+layer stacking (AI server), blind buried hole technology
→ Applicable fields: 5G base station, auto drive system, medical imaging equipment (such as CT).
Single panel:
Simple circuit optimization: Compact layout meets basic functions such as calculators and thermostats
Cost sensitive scenarios: Small appliances (rice cookers) and educational electronics (electronic dictionaries) account for 70% of applications;
→ Limitations: Unable to achieve impedance control, not suitable for high-speed signals.

5、 Comparison between Sustainability and Environmental Protection
Multilayer board:
The halogen-free FR-4 substrate complies with RoHS, but it is difficult to recycle (the interlayer adhesive resin is difficult to separate);
Electroplating wastewater contains cyanide and requires specialized treatment.
Single panel:
The recycling rate of paper-based (22F) waste reaches 60%;
Zhiwen Electronics and other manufacturers promote lead-free solder+water-based ink technology

summary
Multi layer board: trading process complexity for high performance - advantages lie in integration, signal integrity, and reliability, but cost and cycle time are drawbacks;
Single panel: Achieving economy with extreme simplification - superior in cost and manufacturing efficiency, but with obvious electrical performance ceiling.