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XRX-10289
DGXRX
Core Advantage Analysis
1. Performance comparison (rolled paper substrate)
Advantages of FR-4 Single Panel Paper Substrate (FR-1)
Mechanical strength Bending strength>400MPa<200MPa (prone to cracking) Vibration resistance ↑ 100%
Heat resistance Tg ≥ 130 ℃, resistance to 288 ℃ solder impact (10 seconds) Tg ≈ 105 ℃ (high temperature delamination), suitable for lead-free soldering process
Environmental stability, water absorption rate<0.1%, resistance to 85 ℃/85% RH humidity and heat for 1000 hours, water absorption rate>0.5% (moisture expansion), industrial scene life>10 years
Electrical performance Dk= 4.5@1MHz The loss factor Df<0.02 Df>0.05 (severe high-frequency attenuation) indicates that signals below 100MHz are more stable
2. Economic advantages
30% lower cost than FR-4 dual panel: 50% reduction in material usage, no lamination/hole metallization process
Extremely low maintenance cost: the fault point can be visually located, and the repair time for overhead lines is less than 3 minutes
Application Fields and Typical Cases
1. Consumer electronics (accounting for 60%)
Product Technical Solution Cost Performance Highlights
Home appliance remote control single key circuit+OSP processing<$0.3/piece anti drop test>5000 times
LED bulb lamp driven aluminum substrate+non isolated solution<$0.5/sheet temperature rise<40 ℃ (5W power consumption)
Electronic scale motherboard FR-4 simplified 4-layer analog circuit $0.4/chip accuracy ± 0.1%
2. Industrial control (accounting for 30%)
PLC relay module:
1oz copper thickness+OSP, resistant to 100000 insertions and removals (IEC 60664 standard)
Temperature and humidity sensor:
Large area copper laying for heat dissipation, with an accuracy of ± 2% in the full temperature range of -40 ℃~85 ℃
3. Automotive Electronics (Special Scenarios)
Window switch: High Tg FR-4 (Tg ≥ 150 ℃), resistant to engine compartment 85 ℃ environment
Disable scenario: ECU/ABS and other high-frequency core systems (single panel wiring restrictions)
Limitations and Solutions
Effectiveness of defect response strategies
Low wiring density jumper or 0 Ω resistor jumper increases wiring flexibility by 30%
Low high-frequency performance>100MHz circuit switched to double-sided board with insertion loss reduced from>3dB to< 1dB@100MHz
Design of heat dissipation bottleneck and thermal conductive holes+local aluminum heat sink embedding with a temperature drop of 10-15 ℃ (5W power consumption scenario)
Core Advantage Analysis
1. Performance comparison (rolled paper substrate)
Advantages of FR-4 Single Panel Paper Substrate (FR-1)
Mechanical strength Bending strength>400MPa<200MPa (prone to cracking) Vibration resistance ↑ 100%
Heat resistance Tg ≥ 130 ℃, resistance to 288 ℃ solder impact (10 seconds) Tg ≈ 105 ℃ (high temperature delamination), suitable for lead-free soldering process
Environmental stability, water absorption rate<0.1%, resistance to 85 ℃/85% RH humidity and heat for 1000 hours, water absorption rate>0.5% (moisture expansion), industrial scene life>10 years
Electrical performance Dk= 4.5@1MHz The loss factor Df<0.02 Df>0.05 (severe high-frequency attenuation) indicates that signals below 100MHz are more stable
2. Economic advantages
30% lower cost than FR-4 dual panel: 50% reduction in material usage, no lamination/hole metallization process
Extremely low maintenance cost: the fault point can be visually located, and the repair time for overhead lines is less than 3 minutes
Application Fields and Typical Cases
1. Consumer electronics (accounting for 60%)
Product Technical Solution Cost Performance Highlights
Home appliance remote control single key circuit+OSP processing<$0.3/piece anti drop test>5000 times
LED bulb lamp driven aluminum substrate+non isolated solution<$0.5/sheet temperature rise<40 ℃ (5W power consumption)
Electronic scale motherboard FR-4 simplified 4-layer analog circuit $0.4/chip accuracy ± 0.1%
2. Industrial control (accounting for 30%)
PLC relay module:
1oz copper thickness+OSP, resistant to 100000 insertions and removals (IEC 60664 standard)
Temperature and humidity sensor:
Large area copper laying for heat dissipation, with an accuracy of ± 2% in the full temperature range of -40 ℃~85 ℃
3. Automotive Electronics (Special Scenarios)
Window switch: High Tg FR-4 (Tg ≥ 150 ℃), resistant to engine compartment 85 ℃ environment
Disable scenario: ECU/ABS and other high-frequency core systems (single panel wiring restrictions)
Limitations and Solutions
Effectiveness of defect response strategies
Low wiring density jumper or 0 Ω resistor jumper increases wiring flexibility by 30%
Low high-frequency performance>100MHz circuit switched to double-sided board with insertion loss reduced from>3dB to< 1dB@100MHz
Design of heat dissipation bottleneck and thermal conductive holes+local aluminum heat sink embedding with a temperature drop of 10-15 ℃ (5W power consumption scenario)