I. Core Advantages: Breakthroughs in Performance and Integration
1. Electrical Performance Advantages
Multilayer Board PerformanceImprovement Over Single/Double Sided Boards
Signal Integrity Dedicated Power/Ground Layers, Impedance ±5% Reduction of crosstalk by 30%, Supporting 112Gbps Transmission
EMC Performance Inner Layer Shielding Rad, Compliance with Automotive CISPR 25 Class 5 Reduction of EMI by 20dB
Thermal Dissipation Capability Inner 2oz Copper Foil Thermal Conduction Array of Thermal Vias Reduction of Thermal Resistance by 40% (at the same power consumption
2. Structural and Integration Advantages
Space Compression: 20-layer HDI board thickness ≤ 1.0mm, volume reduction by 0% compared to double-sided boards (smartphone mainboards);
High-Density Packaging: Support for 0.35mm pitch BGA, 1005 components, 5x increase in component density;
System-Level Cost Reduction: Integration of multiple double-sided board functions, reducing connector costs by30% (e.g., automotive domain controller).
3. Enhanced Reliability
Survives 100,000 thermal cycles from55℃ to 150℃ (Military Standard MIL-STD-202);
Withstands 1000 hours of damp heat test85℃/85% RH) (industrial equipment lifespan > 15 years).
II. Application Fields: High-Frequency, High-D, and Necessity Scenarios
1. Communication and Computing (45% of total)
Application Scenarios Technology Solutions Performance Parameters
5G Station AAU Antenna 12-layer hybrid (FR-4 RO4350B) Impedance ±3%, Insertion Loss < .3dB@28GHz
AI Server Motherboard 16–20 layers HDI embedded resistors and capacitors Supports PCIe 5.032GT/s)
Optical Module 8-layer ultra-thin board (0.4mm) Withstands high temperatures (Tg ≥ 70℃)
2. Automotive Electronics (25% of total)
Smart Driving Domain Controller: 8-layer aluminum substrate 2oz thick copper, conductivity 4.0W/mK;
800V Battery Management System: 6-layer ceramic-filled FR-4, insulation resistance > 10GΩ.
3. High-End Consumer Electronics (20% of total)
Foldable Screen Smartphone: 10-layer rigid-flex hybrid, bending radius 3mm (
AR/VR Devices: 6-layer HDI board, supporting 4K@120Hz video transmission). 4. Special Fields
Medical Imaging: Low-loss boards (Df < 0.02), ensuring precision of MRI gradient coils;
Satellite Communication Polyimide multilayer boards, radiation resistance > 100krad.
III. Core Process Technologies
1. Precision Lamination and Interconnection Processes
Key Technological PointsPrecision Requirements
Inner Layer Fabrication Core board LDI exposure (line width ±0.05mm) → Acidic etching AOI inspection Line width tolerance ±0.05mm
Stackup Lamination Core board PP film vacuum hot pressing (180℃/40psi) → Cooling and setting Layer-to-layer offset ≤ 75μm
Laser Drilling UV laser drilling of blind and buried holes ( diameter 0.1mm) → Plasma removal of glue residue Hole position accuracy ±0.03mm
Hole Metallization Pulse electropl to fill holes (hole copper ≥ 25μm) → Filling hole electroplating (HDI boards) Deep to diameter ratio ≥ 10:
Surface Treatment ENIG immersion gold (BGA area) / immersion silver (high-frequency signal area) Immersion gold layer thickness 0.05–01μm
2. Advanced Process Breakthroughs
Any Layer Interconnection (ELIC):
Full-board laser microvia (hole diameter 50μm) canceling mechanical through holes, achieving 20 layers of full high-density interconnection.
Hybrid Design:
High-frequency area (Rogers RO350B) FR-4 digital area simultaneous lamination, reducing costs by 40% compared to all-high-frequency boards.
Embedded Comp:
Resistors/capacitors embedded in inner layers (precision ±5%), reducing 30% of surface mount space
