Customized Production of Single-sided Printed Circuit Boards for Application in Household Appliances And Consumer Electronics

Core Advantage Analysis

1. Performance and reliability

Advantages of FR-4 single panel compared to paper substrate (FR-1)
Mechanical strength Bending strength>400MPa<200MPa (prone to cracking) Vibration resistance ↑ 100%
Heat resistance Tg ≥ 130 ℃, resistance to 288 ℃ solder impact (10 seconds) Tg ≈ 105 ℃ (high temperature delamination), suitable for lead-free soldering
Environmental stability, water absorption rate<0.1%, resistance to 85 ℃/85% RH humidity and heat for 1000 hours, water absorption rate>0.5% (moisture expansion), industrial scene life>10 years
Electrical performance Dk= 4.5@1MHz The loss factor Df<0.02 Df>0.05 (severe high-frequency attenuation) indicates that signals below 100MHz are more stable

2. Economic advantages

Cost crushing:

The material cost is 30-50% lower than double-sided panels (¥ 20-50/㎡) and 60-80% lower than multi-layer panels

Typical application: Home appliance remote control (cost<$0.3/piece)

Delivery speed:

24-hour urgent sampling (5-7 days for multi-layer boards)

Easy maintenance:

The fault point can be visually located, and the repair time for the flying wire is less than 3 minutes

3、 Application Fields and Typical Cases
1. Consumer electronics (accounting for 65%)
Product type, substrate selection, technical solution, cost
Home appliance remote control paper substrate (94V0) single key circuit+OSP processing<$0.2/piece
LED bulb light driven aluminum substrate non isolated solution+thick copper design<$0.5/piece
Electronic toy motherboard FR-4 Lite MCU circuit $0.3-0.5/chip
2. Industrial control (accounting for 25%)
PLC relay module:
FR-4 single-sided+OSP treatment, resistant to 100000 insertions and removals (IEC 60664 standard)

Temperature and humidity sensor:
Large area copper laying for heat dissipation, with an accuracy of ± 2% in the full temperature range of -40 ℃~85 ℃

3. Automotive Electronics (Special Adaptation)
Window switch/seat heater: High Tg FR-4 (Tg ≥ 150 ℃), resistant to engine compartment 85 ℃ environment

Disable scenario: ECU/ABS and other high-frequency core systems (insufficient wiring density)

4、 Limitations and coping strategies
Effect of defect solution
Low wiring density jumper or 0 Ω resistor jumper increases wiring flexibility by 30%
Low high-frequency performance>100MHz circuit switched to double-sided board with insertion loss reduced from>3dB to< 1dB@100MHz
Design of heat dissipation bottleneck and thermal conductive holes+local aluminum heat sink embedding with a temperature drop of 10-15 ℃ (5W power consumption scenario)