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XRX-12848
DGXRX
Substrate preparation
Material composition: Epoxy resin is used as the adhesive, electronic grade glass fiber cloth is used as the reinforcement material, and copper foil (usually 1/2 oz~2 oz thick) is pressed on the surface.
Laminated molding: High temperature and high pressure pressing allows resin to uniformly penetrate glass fibers, forming a flat substrate (thickness range of 0.4~3.2 mm).
Graphic transfer and etching
Photolithography process: coating photoresist → exposure → development, defining circuit pattern 23.
Etching molding: Acidic etching solution (such as ferric chloride) is used to remove the copper layer in the non circuit area, forming wires (minimum line width/spacing ≥ 0.2 mm).
Drilling and surface treatment
Mechanical drilling: Only single-sided drilling (aperture ≥ 0.3 mm) is required, without the need for metalized hole (PTH) process26.
Surface protection: Optional tin spray (lead/lead-free), immersion gold, OSP (organic solder mask) or solder mask ink (green/black) can be used to enhance weldability and oxidation resistance.
Heat dissipation optimization (special design)
Thermal conductivity structure: Some designs add heat dissipation holes and aluminum thermal conductivity plates below the substrate to improve thermal conductivity efficiency (reduce thermal resistance by 40%).
Mechanical reinforcement: Modular installation is achieved through the structure of sliding grooves and positioning plates, which facilitates maintenance and repair.
⚙️ 2、 Core advantages
The competitiveness of FR-4 single panel lies in the balance between its comprehensive performance and economy:
Excellent mechanical performance
High strength: The glass fiber reinforced structure provides high bending strength (>415 MPa) and can withstand assembly stress and vibration impact.
Environmental resistance: Operating temperature range of -45 ° C~130 ° C (Tg value), suitable for humid and chemically corrosive environments.
Electrical and safety characteristics
Reliable insulation: dielectric strength ≥ 40 kV/mm, effectively preventing leakage and short circuit.
Flame retardant certification: compliant with UL94 V-0 standard, self extinguishing in case of fire, enhancing the safety of end products.
Cost and Production Efficiency
Low material cost: More than 30% lower in cost than multi-layer FR-4 board, and lower in cost for paper substrates (such as 94V0).
Efficient processing: Simplified process (without PTH or lamination steps), batch production cycle can be shortened to 24 hours.
design flexibility
Heat dissipation optimization: supports integrated heat dissipation holes and metal thermal conductive layers, suitable for power devices.
Fast iteration: suitable for prototype validation and small batch customization, compatible with various surface processes such as tin spraying/gold deposition.
FR-4 single-sided circuit board is an ideal choice for low-cost, high reliability, and fast delivery scenarios, and its core value lies in:
Mature technology: Standardized processes ensure mass production efficiency and consistency;
Safe and reliable: V-0 flame retardant+mechanical strength meets basic electronic requirements;
Flexible adaptation: It can be extended to the industrial and automotive fields through heat dissipation and structural design.
Limitations and Trends: Limited by single-layer wiring, unable to support high-density integration; In the future, it will evolve towards thin (portable devices) and modified upgrades (low loss FR-4), continuously penetrating the IoT and new energy fields
Substrate preparation
Material composition: Epoxy resin is used as the adhesive, electronic grade glass fiber cloth is used as the reinforcement material, and copper foil (usually 1/2 oz~2 oz thick) is pressed on the surface.
Laminated molding: High temperature and high pressure pressing allows resin to uniformly penetrate glass fibers, forming a flat substrate (thickness range of 0.4~3.2 mm).
Graphic transfer and etching
Photolithography process: coating photoresist → exposure → development, defining circuit pattern 23.
Etching molding: Acidic etching solution (such as ferric chloride) is used to remove the copper layer in the non circuit area, forming wires (minimum line width/spacing ≥ 0.2 mm).
Drilling and surface treatment
Mechanical drilling: Only single-sided drilling (aperture ≥ 0.3 mm) is required, without the need for metalized hole (PTH) process26.
Surface protection: Optional tin spray (lead/lead-free), immersion gold, OSP (organic solder mask) or solder mask ink (green/black) can be used to enhance weldability and oxidation resistance.
Heat dissipation optimization (special design)
Thermal conductivity structure: Some designs add heat dissipation holes and aluminum thermal conductivity plates below the substrate to improve thermal conductivity efficiency (reduce thermal resistance by 40%).
Mechanical reinforcement: Modular installation is achieved through the structure of sliding grooves and positioning plates, which facilitates maintenance and repair.
⚙️ 2、 Core advantages
The competitiveness of FR-4 single panel lies in the balance between its comprehensive performance and economy:
Excellent mechanical performance
High strength: The glass fiber reinforced structure provides high bending strength (>415 MPa) and can withstand assembly stress and vibration impact.
Environmental resistance: Operating temperature range of -45 ° C~130 ° C (Tg value), suitable for humid and chemically corrosive environments.
Electrical and safety characteristics
Reliable insulation: dielectric strength ≥ 40 kV/mm, effectively preventing leakage and short circuit.
Flame retardant certification: compliant with UL94 V-0 standard, self extinguishing in case of fire, enhancing the safety of end products.
Cost and Production Efficiency
Low material cost: More than 30% lower in cost than multi-layer FR-4 board, and lower in cost for paper substrates (such as 94V0).
Efficient processing: Simplified process (without PTH or lamination steps), batch production cycle can be shortened to 24 hours.
design flexibility
Heat dissipation optimization: supports integrated heat dissipation holes and metal thermal conductive layers, suitable for power devices.
Fast iteration: suitable for prototype validation and small batch customization, compatible with various surface processes such as tin spraying/gold deposition.
FR-4 single-sided circuit board is an ideal choice for low-cost, high reliability, and fast delivery scenarios, and its core value lies in:
Mature technology: Standardized processes ensure mass production efficiency and consistency;
Safe and reliable: V-0 flame retardant+mechanical strength meets basic electronic requirements;
Flexible adaptation: It can be extended to the industrial and automotive fields through heat dissipation and structural design.
Limitations and Trends: Limited by single-layer wiring, unable to support high-density integration; In the future, it will evolve towards thin (portable devices) and modified upgrades (low loss FR-4), continuously penetrating the IoT and new energy fields