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XRX-2571
DGXRX
Process technology: Standardized processes ensure high reliability
The manufacturing of FR-4 multilayer board integrates precision lamination and graphic technology, and the key processes include:
Inner layer graphic production
Substrate preparation: Glass fiber cloth reinforced epoxy resin (Tg value 130 ° C-180 ° C optional), copper foil thickness 1/2-20 oz can be customized.
Graphic transfer: dry film/wet film lithography → exposure → development → acid etching, achieving precise wiring with line width/spacing ≥ 75 μ m.
Layering and Drilling
Stacked structure: The inner core board and semi cured sheet (PP) are alternately stacked and formed by high-temperature and high-pressure (180 ° C-200 ° C) compression molding.
Mechanical drilling: The minimum aperture is 0.15mm, and the hole wall is treated with chemical copper deposition and electroplating (copper thickness ≥ 20 μ m) to ensure reliable interlayer conductivity.
Outer layer and surface treatment
Secondary graphic transfer: using the same inner layer process to achieve double-sided wiring.
Solder mask and identification: coated with epoxy resin ink (green/black/white), hardness>5H, anti oxidation and mechanical damage 89.
Surface treatment: ENIG (chemical nickel gold), HASL-LF (lead-free tin spraying), OSP, etc. can be selected to meet different soldering needs.
Testing and Forming
Electrical performance test: flying needle/needle bed on/off test (ET), impedance control ± 10%.
Appearance processing: CNC milling+V-cut cutting, supporting assembly and mass production
Core advantage: The ultimate balance between performance and cost
Electrical and Mechanical Performance
Signal integrity: dielectric constant (Dk ≈ 4.3-) 4.7@1GHz ）Stable and capable of transmitting signals at medium to low speeds (≤ 5Gbps).
Mechanical strength: Glass fiber reinforced bending strength>415MPa, anti vibration impact (vehicle grade vibration tolerance).
Environmental adaptability
Heat resistance: Tg value of 130 ° C-180 ° C, compatible with lead-free soldering (peak temperature of 260 ° C).
Flame retardant safety: UL94 V-0 certification, self extinguishing in case of fire.
Chemical and moisture resistance: The epoxy resin structure is resistant to corrosion in industrial environments.
Cost and Manufacturing Efficiency
Low raw material cost: 30-50% lower than high-frequency boards (such as Rogers).
High process maturity: Global standardized production lines support rapid mass production, with a yield rate of over 98%
Process technology: Standardized processes ensure high reliability
The manufacturing of FR-4 multilayer board integrates precision lamination and graphic technology, and the key processes include:
Inner layer graphic production
Substrate preparation: Glass fiber cloth reinforced epoxy resin (Tg value 130 ° C-180 ° C optional), copper foil thickness 1/2-20 oz can be customized.
Graphic transfer: dry film/wet film lithography → exposure → development → acid etching, achieving precise wiring with line width/spacing ≥ 75 μ m.
Layering and Drilling
Stacked structure: The inner core board and semi cured sheet (PP) are alternately stacked and formed by high-temperature and high-pressure (180 ° C-200 ° C) compression molding.
Mechanical drilling: The minimum aperture is 0.15mm, and the hole wall is treated with chemical copper deposition and electroplating (copper thickness ≥ 20 μ m) to ensure reliable interlayer conductivity.
Outer layer and surface treatment
Secondary graphic transfer: using the same inner layer process to achieve double-sided wiring.
Solder mask and identification: coated with epoxy resin ink (green/black/white), hardness>5H, anti oxidation and mechanical damage 89.
Surface treatment: ENIG (chemical nickel gold), HASL-LF (lead-free tin spraying), OSP, etc. can be selected to meet different soldering needs.
Testing and Forming
Electrical performance test: flying needle/needle bed on/off test (ET), impedance control ± 10%.
Appearance processing: CNC milling+V-cut cutting, supporting assembly and mass production
Core advantage: The ultimate balance between performance and cost
Electrical and Mechanical Performance
Signal integrity: dielectric constant (Dk ≈ 4.3-) 4.7@1GHz ）Stable and capable of transmitting signals at medium to low speeds (≤ 5Gbps).
Mechanical strength: Glass fiber reinforced bending strength>415MPa, anti vibration impact (vehicle grade vibration tolerance).
Environmental adaptability
Heat resistance: Tg value of 130 ° C-180 ° C, compatible with lead-free soldering (peak temperature of 260 ° C).
Flame retardant safety: UL94 V-0 certification, self extinguishing in case of fire.
Chemical and moisture resistance: The epoxy resin structure is resistant to corrosion in industrial environments.
Cost and Manufacturing Efficiency
Low raw material cost: 30-50% lower than high-frequency boards (such as Rogers).
High process maturity: Global standardized production lines support rapid mass production, with a yield rate of over 98%