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XRX-10267
DGXRX
Drilling difficulties: Only mechanical drilling (aperture ≥ 0.4mm) is supported, and laser drilling of micropores is not possible (high risk of paper-based carbonization), which restricts high-density interconnection.
Laminated challenge: Water absorption rate>0.5%, baking at 120 ℃ for 2 hours to control humidity before lamination, there is still a risk of board bursting.
Insufficient temperature resistance: Tg ≈ 105 ℃, strict temperature control is required during lead-free soldering (peak value 260 ℃) (tin furnace ≤ 285 ℃/5 seconds), otherwise the copper foil will bubble.
Conclusion: 94V0 is essentially a single panel material, and multi-layer production requires the use of fiberglass substrates such as CEM-3 or FR-4.
Advantage Dimension 94V0 Performance Comparison FR-4
The cost of sheet metal is ¥ 20-30/㎡, which is 60% lower than FR-4 and suitable for large-scale stamping (monthly production>20000 ㎡)
Flame retardant UL 94 V-0 certification (10 second self extinguishing) at the same level as FR-4, meeting basic safety regulations
Environmentally friendly paper-based material is biodegradable, with a copper recovery rate of over 90%. Glass fiber is difficult to recycle and causes higher pollution
Delivery speed: urgent sample delivery within 24 hours, batch cycle of 3-4 days, 50% faster than FR-4 multi-layer board
Home appliance control board: electric fan timer, remote control (double-sided wiring simplified jumper).
Temperature and humidity sensor: operates in the full temperature range of -40 ℃~85 ℃, with large-area copper plating to assist in heat dissipation.
High temperature environment: When the continuous working temperature is greater than 105 ℃, there is a high risk of stratification (prohibited in car engine compartments).
Material type, key characteristics, applicable scenarios
CEM-3 double-sided semi fiberglass board, with a cost 10% lower than FR-4, supports 4-6 layers of industrial control motherboards and LED driver boards
High Tg FR-4 Tg ≥ 170 ℃, lead-free soldering resistance, supports 12+layers of automotive electronics and server power modules
Halogen free FR-4 bromine content<900ppm, flame retardant UL94 V-0 EU environmentally friendly product (mandatory under RoHS directive)
Selection suggestion:
Low frequency boards with less than 4 layers: preferably CEM-3 (cost performance balance);
High frequency board with more than 6 layers: FR-4 mixed compression high-frequency material (such as Rogers RO4350B) must be selected
Drilling difficulties: Only mechanical drilling (aperture ≥ 0.4mm) is supported, and laser drilling of micropores is not possible (high risk of paper-based carbonization), which restricts high-density interconnection.
Laminated challenge: Water absorption rate>0.5%, baking at 120 ℃ for 2 hours to control humidity before lamination, there is still a risk of board bursting.
Insufficient temperature resistance: Tg ≈ 105 ℃, strict temperature control is required during lead-free soldering (peak value 260 ℃) (tin furnace ≤ 285 ℃/5 seconds), otherwise the copper foil will bubble.
Conclusion: 94V0 is essentially a single panel material, and multi-layer production requires the use of fiberglass substrates such as CEM-3 or FR-4.
Advantage Dimension 94V0 Performance Comparison FR-4
The cost of sheet metal is ¥ 20-30/㎡, which is 60% lower than FR-4 and suitable for large-scale stamping (monthly production>20000 ㎡)
Flame retardant UL 94 V-0 certification (10 second self extinguishing) at the same level as FR-4, meeting basic safety regulations
Environmentally friendly paper-based material is biodegradable, with a copper recovery rate of over 90%. Glass fiber is difficult to recycle and causes higher pollution
Delivery speed: urgent sample delivery within 24 hours, batch cycle of 3-4 days, 50% faster than FR-4 multi-layer board
Home appliance control board: electric fan timer, remote control (double-sided wiring simplified jumper).
Temperature and humidity sensor: operates in the full temperature range of -40 ℃~85 ℃, with large-area copper plating to assist in heat dissipation.
High temperature environment: When the continuous working temperature is greater than 105 ℃, there is a high risk of stratification (prohibited in car engine compartments).
Material type, key characteristics, applicable scenarios
CEM-3 double-sided semi fiberglass board, with a cost 10% lower than FR-4, supports 4-6 layers of industrial control motherboards and LED driver boards
High Tg FR-4 Tg ≥ 170 ℃, lead-free soldering resistance, supports 12+layers of automotive electronics and server power modules
Halogen free FR-4 bromine content<900ppm, flame retardant UL94 V-0 EU environmentally friendly product (mandatory under RoHS directive)
Selection suggestion:
Low frequency boards with less than 4 layers: preferably CEM-3 (cost performance balance);
High frequency board with more than 6 layers: FR-4 mixed compression high-frequency material (such as Rogers RO4350B) must be selected