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XRX-10548
DGXRX
1、 Core process technology
1. Precision lamination and interconnection process
Key technical points of the process, precision requirements
Inner layer production FR-4 core board cutting → LDI laser imaging (line width ± 0.05mm) → acid etching → AOI detection line width tolerance ± 0.05mm
Stacked laminated core board+semi cured sheet (PP sheet) alternately stacked → vacuum hot pressing (180 ℃/400psi) → cooling and shaping interlayer offset ≤ 75 μ m
Laser drilling CO ₂/UV laser drilling blind buried hole (aperture 0.1-0.2mm) → plasma slag removal hole position accuracy ± 0.03mm
Chemical deposition of copper through hole metallization (0.3 μ m) → electroplating thickening (hole copper ≥ 25 μ m) → hole filling electroplating (HDI board) with a depth to diameter ratio ≥ 8:1
Surface treatment ENIG immersion gold (contact area)/OSP (solder area)/immersion tin (high reliability) solder bridge width ≥ 0.1mm
2. Breakthrough in advanced technology
Any Layer Interconnect (ELIC):
Full board laser micro holes (aperture 50 μ m), eliminating mechanical through holes, achieving 20 layer high density stacking (mainstream technology for mobile phone motherboards).
Mixed pressure design:
High frequency area (Rogers RO4350B)+FR-4 digital area synchronous compression, solving the problem of 5G signal loss (insertion loss<) 0.2dB@10GHz ）.
Thin core technology:
0.15mm ultra-thin core board replaces traditional PP sheet, breaking the limit of 0.4mm ultra-thin multi-layer board.
2、 Material characteristics and selection
Classification of FR-4 epoxy resin substrates
Type characteristics applicable scenarios
Standard FR-4 Tg ≈ 130 ℃, Dk= 4.5@1MHz Low cost consumer electronics/industrial control motherboard
High Tg FR-4 Tg ≥ 170 ℃, lead-free soldering resistant (peak 260 ℃) automotive electronic/server power supply
Halogen free FR-4 with bromine content<900ppm, flame retardant UL94 V-0 EU environmentally friendly product (RoHS directive)
Modified FR-4 Dk=3.8 ± 0.1@10GHz (Ceramic fillers reduce losses) High speed digital circuits (≤ 5GHz)
The golden rule for selecting materials:
Consumer Electronics: Standard FR-4 (Cost Optimal)
Automotive/Military Industry: High Tg FR-4 (heat-resistant and vibration resistant)
5G Communication: Modified FR-4 or Hybrid High Frequency Materials
3、 Core Advantage Analysis
1. Electrical and structural performance
Performance comparison of FR-4 multi-layer board with single/double-sided board improvement
Dedicated power supply/layer for signal integrity, impedance control ± 5%, crosstalk reduction 30%, supporting 56Gbps transmission
Heat dissipation capability: Inner layer 2oz thick copper thermal conductivity+heat dissipation via thermal resistance reduced by 40% (equivalent power consumption)
Integrated density supports 0.35mm pitch BGA, 01005 component volume reduces by 70% compared to double-sided boards
Reliability passed -55 ℃~150 ℃ thermal cycle 100000 times industrial environment life>15 years
2. Economic advantages
High cost-effectiveness: The cost of 8-layer FR-4 board is only 1/5 of that of high-frequency board (such as PTFE);
Fast iteration: 24-hour rapid prototyping (HDI technology), batch delivery cycle of 5-7 days.
4、 Application Fields and Typical Cases
1. Communication and computing (accounting for 45%)
Application scenario technical solution performance parameters
5G base station AAU antenna board 12 layer mixed voltage (FR-4+RO4350B) impedance ± 3%, insertion loss ＜ 0.3dB@28GHz
AI server motherboard 16 layer HDI+buried resistor and capacitor support 112G PAM4 signal
Optical module PCB 8-layer ultra-thin board (0.4mm) with high temperature resistance (Tg ≥ 170 ℃)
2. Automotive electronics (accounting for 25%)
Intelligent cockpit domain controller: 8-layer Tg FR-4, resistant to engine compartment high temperature of 85 ℃;
800V battery management system: 6-layer ceramic filled FR-4, insulation resistance>100G Ω.
3. Consumer electronics (accounting for 20%)
Smartphone: 10 layers of arbitrary HDI (line width 40 μ m), thickness ≤ 1.0mm;
AR/VR equipment: 6-layer rigid flex bonding plate with a bending radius of 3mm.
4. Special fields
Medical equipment: MRI gradient coil plate (Df<0.02), ensuring image accuracy;
Aerospace: Polyimide-FR-4 mixed pressure, radiation resistance>100krad.
5、 Process Challenges and Countermeasures
Technological progress in challenge solutions
High frequency loss PTFE mixed pressure+ceramic modified resin domestic carbon hydrogen plate (Dk=3.0) mass production
Ultra thin board warping symmetrical stack+low CTE material (CTE<10ppm/℃) laser real-time deformation compensation
Uneven pulse reverse electroplating and oscillation filling with a depth to diameter ratio of 12:1 for microporous plating, breakthrough in microporous capability
1、 Core process technology
1. Precision lamination and interconnection process
Key technical points of the process, precision requirements
Inner layer production FR-4 core board cutting → LDI laser imaging (line width ± 0.05mm) → acid etching → AOI detection line width tolerance ± 0.05mm
Stacked laminated core board+semi cured sheet (PP sheet) alternately stacked → vacuum hot pressing (180 ℃/400psi) → cooling and shaping interlayer offset ≤ 75 μ m
Laser drilling CO ₂/UV laser drilling blind buried hole (aperture 0.1-0.2mm) → plasma slag removal hole position accuracy ± 0.03mm
Chemical deposition of copper through hole metallization (0.3 μ m) → electroplating thickening (hole copper ≥ 25 μ m) → hole filling electroplating (HDI board) with a depth to diameter ratio ≥ 8:1
Surface treatment ENIG immersion gold (contact area)/OSP (solder area)/immersion tin (high reliability) solder bridge width ≥ 0.1mm
2. Breakthrough in advanced technology
Any Layer Interconnect (ELIC):
Full board laser micro holes (aperture 50 μ m), eliminating mechanical through holes, achieving 20 layer high density stacking (mainstream technology for mobile phone motherboards).
Mixed pressure design:
High frequency area (Rogers RO4350B)+FR-4 digital area synchronous compression, solving the problem of 5G signal loss (insertion loss<) 0.2dB@10GHz ）.
Thin core technology:
0.15mm ultra-thin core board replaces traditional PP sheet, breaking the limit of 0.4mm ultra-thin multi-layer board.
2、 Material characteristics and selection
Classification of FR-4 epoxy resin substrates
Type characteristics applicable scenarios
Standard FR-4 Tg ≈ 130 ℃, Dk= 4.5@1MHz Low cost consumer electronics/industrial control motherboard
High Tg FR-4 Tg ≥ 170 ℃, lead-free soldering resistant (peak 260 ℃) automotive electronic/server power supply
Halogen free FR-4 with bromine content<900ppm, flame retardant UL94 V-0 EU environmentally friendly product (RoHS directive)
Modified FR-4 Dk=3.8 ± 0.1@10GHz (Ceramic fillers reduce losses) High speed digital circuits (≤ 5GHz)
The golden rule for selecting materials:
Consumer Electronics: Standard FR-4 (Cost Optimal)
Automotive/Military Industry: High Tg FR-4 (heat-resistant and vibration resistant)
5G Communication: Modified FR-4 or Hybrid High Frequency Materials
3、 Core Advantage Analysis
1. Electrical and structural performance
Performance comparison of FR-4 multi-layer board with single/double-sided board improvement
Dedicated power supply/layer for signal integrity, impedance control ± 5%, crosstalk reduction 30%, supporting 56Gbps transmission
Heat dissipation capability: Inner layer 2oz thick copper thermal conductivity+heat dissipation via thermal resistance reduced by 40% (equivalent power consumption)
Integrated density supports 0.35mm pitch BGA, 01005 component volume reduces by 70% compared to double-sided boards
Reliability passed -55 ℃~150 ℃ thermal cycle 100000 times industrial environment life>15 years
2. Economic advantages
High cost-effectiveness: The cost of 8-layer FR-4 board is only 1/5 of that of high-frequency board (such as PTFE);
Fast iteration: 24-hour rapid prototyping (HDI technology), batch delivery cycle of 5-7 days.
4、 Application Fields and Typical Cases
1. Communication and computing (accounting for 45%)
Application scenario technical solution performance parameters
5G base station AAU antenna board 12 layer mixed voltage (FR-4+RO4350B) impedance ± 3%, insertion loss ＜ 0.3dB@28GHz
AI server motherboard 16 layer HDI+buried resistor and capacitor support 112G PAM4 signal
Optical module PCB 8-layer ultra-thin board (0.4mm) with high temperature resistance (Tg ≥ 170 ℃)
2. Automotive electronics (accounting for 25%)
Intelligent cockpit domain controller: 8-layer Tg FR-4, resistant to engine compartment high temperature of 85 ℃;
800V battery management system: 6-layer ceramic filled FR-4, insulation resistance>100G Ω.
3. Consumer electronics (accounting for 20%)
Smartphone: 10 layers of arbitrary HDI (line width 40 μ m), thickness ≤ 1.0mm;
AR/VR equipment: 6-layer rigid flex bonding plate with a bending radius of 3mm.
4. Special fields
Medical equipment: MRI gradient coil plate (Df<0.02), ensuring image accuracy;
Aerospace: Polyimide-FR-4 mixed pressure, radiation resistance>100krad.
5、 Process Challenges and Countermeasures
Technological progress in challenge solutions
High frequency loss PTFE mixed pressure+ceramic modified resin domestic carbon hydrogen plate (Dk=3.0) mass production
Ultra thin board warping symmetrical stack+low CTE material (CTE<10ppm/℃) laser real-time deformation compensation
Uneven pulse reverse electroplating and oscillation filling with a depth to diameter ratio of 12:1 for microporous plating, breakthrough in microporous capability