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XRX-12849
DGXRX
Material composition and core properties
Base material structure
22F boards use cotton fiber paper as the core impregnated with flame retardant epoxy phenolic resin, covered with alkali-free glass cloth reinforcement layers on both sides, and copper foil (usually 3μm) on the surface. This composite structure combines flexibility and rigidity, ensuring electrical performance and enhancing mechanical strength.
Flame retardancy and environmental performance
Me 94V-0 grade flammability standard, and achieve high fire safety by adding flame retardants (such as halogen-free alumina trihydrate) and low smoke and non-toxic during combustion, meeting environmental requirements (RoHS standard).
Electrical and mechanical parameters
Dielectric properties: stable dielectric (ε≈4.4) and low loss factor, suitable for medium and low frequency circuits.
Peel strength: ≥1.5 N/mm, ensuring the copper foil is firmly bonded to the base material.
Thermal resistance: passed the 288℃ thermal shock test (no delamination within 1 seconds), and can adapt to high-temperature welding environment.
II. Core manufacturing process and key technology
Resin impregnation and lamination
Res formula: a mixture of epoxy phenolic resin and flame retardant, ensuring full penetration of the cotton paper through two impregnations (traditional process requires flame retard paper, and modern improvements can use ordinary paper for one-time impregnation).
Flow control: precisely control the resin flow during lamination (reduced from 4kg/ton to the optimized value), avoid pits and scratches, and ensure uniform thickness.
Rapid prototyping technology
Punching and V-cutting: mold punching and digital V-cutting forming, minimum hole diameter 0.35mm (plated through hole), hole position tolerance ±0.05mm, suitable high precision requirements.
Surface process: optional surface treatment such as spraying tin (with lead/lead-free), gold immersion, OSP, etc., to solderability and corrosion resistance.
Efficient production process
Typical delivery cycle for single-sided boards:
Rush samples: 12–24
Mass production: 5–6 days (including mold opening manufacturing)
III. Performance advantages and application scenarios
Cost and efficiency advantages
Simplified: single-layer wiring reduces the complexity of lamination and drilling, and the cost is more than 30% lower than that of multilayer PCB.
High: after optimizing the flow, the defect rate is reduced by 20%, suitable for large-scale production.
Electrical and mechanical properties
Signal integrity:-layer wiring reduces crosstalk, suitable for power circuits, audio devices (such as audio, TV motherboard).
Environmental adaptability: resistant to damp heat chemical corrosion, and can operate stably in harsh environments such as automotive electronics (navigation system), industrial controllers, etc.
Sustainability
Cotton fiber base material recyclable, and the manufacturing scrap has a re-utilization rate of 60%, reducing resource consumption.
IV. Process challenges and solutions
Brittlen issues
Plasticizer addition: improve toughness by modifying the resin (such as adding flexible epoxy monomers) to avoid base material cracking during punching.
Optim of lamination parameters: adjust temperature gradient (110℃→180℃ segmented temperature rise) and pressure (300–400 psi) reduce internal stress.
Limitations of high-frequency applications
High frequency loss: paper-based materials have high dielectric loss, and it is recommended to use Rogers boardssuch as RO4350B) for high-frequency circuits.
Solution: local mixed pressing design (using ceramic substrates in high-frequency areas)
Material composition and core properties
Base material structure
22F boards use cotton fiber paper as the core impregnated with flame retardant epoxy phenolic resin, covered with alkali-free glass cloth reinforcement layers on both sides, and copper foil (usually 3μm) on the surface. This composite structure combines flexibility and rigidity, ensuring electrical performance and enhancing mechanical strength.
Flame retardancy and environmental performance
Me 94V-0 grade flammability standard, and achieve high fire safety by adding flame retardants (such as halogen-free alumina trihydrate) and low smoke and non-toxic during combustion, meeting environmental requirements (RoHS standard).
Electrical and mechanical parameters
Dielectric properties: stable dielectric (ε≈4.4) and low loss factor, suitable for medium and low frequency circuits.
Peel strength: ≥1.5 N/mm, ensuring the copper foil is firmly bonded to the base material.
Thermal resistance: passed the 288℃ thermal shock test (no delamination within 1 seconds), and can adapt to high-temperature welding environment.
II. Core manufacturing process and key technology
Resin impregnation and lamination
Res formula: a mixture of epoxy phenolic resin and flame retardant, ensuring full penetration of the cotton paper through two impregnations (traditional process requires flame retard paper, and modern improvements can use ordinary paper for one-time impregnation).
Flow control: precisely control the resin flow during lamination (reduced from 4kg/ton to the optimized value), avoid pits and scratches, and ensure uniform thickness.
Rapid prototyping technology
Punching and V-cutting: mold punching and digital V-cutting forming, minimum hole diameter 0.35mm (plated through hole), hole position tolerance ±0.05mm, suitable high precision requirements.
Surface process: optional surface treatment such as spraying tin (with lead/lead-free), gold immersion, OSP, etc., to solderability and corrosion resistance.
Efficient production process
Typical delivery cycle for single-sided boards:
Rush samples: 12–24
Mass production: 5–6 days (including mold opening manufacturing)
III. Performance advantages and application scenarios
Cost and efficiency advantages
Simplified: single-layer wiring reduces the complexity of lamination and drilling, and the cost is more than 30% lower than that of multilayer PCB.
High: after optimizing the flow, the defect rate is reduced by 20%, suitable for large-scale production.
Electrical and mechanical properties
Signal integrity:-layer wiring reduces crosstalk, suitable for power circuits, audio devices (such as audio, TV motherboard).
Environmental adaptability: resistant to damp heat chemical corrosion, and can operate stably in harsh environments such as automotive electronics (navigation system), industrial controllers, etc.
Sustainability
Cotton fiber base material recyclable, and the manufacturing scrap has a re-utilization rate of 60%, reducing resource consumption.
IV. Process challenges and solutions
Brittlen issues
Plasticizer addition: improve toughness by modifying the resin (such as adding flexible epoxy monomers) to avoid base material cracking during punching.
Optim of lamination parameters: adjust temperature gradient (110℃→180℃ segmented temperature rise) and pressure (300–400 psi) reduce internal stress.
Limitations of high-frequency applications
High frequency loss: paper-based materials have high dielectric loss, and it is recommended to use Rogers boardssuch as RO4350B) for high-frequency circuits.
Solution: local mixed pressing design (using ceramic substrates in high-frequency areas)