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XRX-102994
DGXRX
1、 Core process technology
Multi layer PCB manufacturing integrates precision materials science and microfabrication technology, with the core process as follows:
Inner layer graphic production
Pattern transfer: Apply a photosensitive dry film on a copper-clad substrate, form a circuit pattern through exposure and development, and then etch to remove excess copper foil .
Browning treatment: Micro etching the copper surface to generate an oxide layer, enhancing interlayer bonding and preventing high-temperature delamination (plate explosion).
Lamination process
Stack the inner layer board, semi cured sheet (prepreg), and copper foil according to the design, and vacuum hot press at 180-200 ℃ and 200-400psi pressure for 60-90 minutes to ensure uniform resin flow without bubbles.
Drilling and hole metallization
Drilling types: through holes (penetrating the entire board), blind holes (outer to inner layers), buried holes (connecting between inner layers), laser drilling can achieve 0.05mm micro holes of .
Copper electroplating: After chemical deposition of copper seed layer, the entire board is electroplated, and the copper thickness of the hole wall needs to be ≥ 25 μ m to ensure conductivity reliability.
Outer layer wiring and surface treatment
Repeat the graphic transfer process to create the outer circuit, and increase the copper thickness by 5 for graphic electroplating.
Surface treatment: ENIG is used for high-density BGA (gold thickness 0.025-0.127 μ m), while HASL has low cost but poor flatness.
Solder mask and testing
Apply solder mask ink to protect the non welding area, and print the component part number 8 with characters.
Electrical testing (such as flying pin testing) verifies connectivity, and AOI detects visual defects.
Technical difficulties and breakthroughs:
Inter layer alignment: For boards with more than 16 layers, an alignment accuracy of ± 25 μ m is required, relying on high-precision exposure equipment.
Impedance control: The high-speed board requires a tolerance of ± 5%, which can be achieved by adjusting the line width/dielectric thickness to .
High frequency materials: 5G communication adopts Rogers RT/duroid 5880 (Dk=2.2), reducing the loss in the 28GHz frequency band by 40%.
2、 Core advantages and limitations
Advantages:
High density integration
The vertical stacking design reduces wiring area, and the smartphone motherboard integrates processor/memory/sensor through 8-12 layer boards.
Signal integrity optimization
The dedicated layer and power layer suppress EMI, and differential signal wiring reduces crosstalk by 60%, supporting 10Gbps+high-speed transmission (such as PCIe 5.0).
Thermal management and power stability
The power plane reduces impedance and ripple noise can be controlled within 50mV; The heat conduction layer or metal substrate (such as aluminum substrate) improves the heat dissipation efficiency by .
Lightweight and Reliable
Replace multiple single panels, reduce equipment weight (such as aerospace equipment), and enhance vibration resistance with a laminated structure.
Limitations:
High cost: The cost of 8-layer board is 4 times that of double-sided board, due to the material (high-frequency substrate is 5-8 times more expensive) and complex process.
Design threshold: It is necessary to simulate signal integrity, and blind buried hole design increases the difficulty by .
Difficulty in maintenance: Inner layer faults require X-ray or layered testing, with a low success rate of 9% in repair.
3、 Application Fields
Multilayer PCBs are irreplaceable in the high-end electronics field:
Typical product technical requirement cases and performance in application fields
Communication equipment 5G base station antenna/Massive MIMO high-frequency low loss, impedance controlled hybrid board (FR-4+Rogers) achieves 18GHz insertion loss ≤ 0.5dB/inch1
Automotive electronic battery management system (BMS)/millimeter wave radar temperature resistance (-40-125 ℃), anti vibration 10 layer BMS board control ripple<50mV; 77GHz radar accuracy ± 0.1 °
Computing hardware AI server/GPU acceleration card high-density wiring, high-speed signal 12 layer board supporting 10Gbps GPU interconnect
Consumer electronics, smartphones/wearable devices, miniaturization, flexible rigid combination folding screen. The phone adopts an 8-layer rigid flexible combination board
Industrial and medical industrial controllers/endoscopes with high reliability and chemical corrosion resistance. Flexible multi-layer boards for medical probes compatible with curved pipelines
4、 Industry Trends
High density interconnect (HDI) technology
Laser blind hole+Build up process achieves line width/line spacing ≤ 50 μ m, meeting the requirements of chip packaging.
Materials Innovation
Nano filler resin (Dk<3.0) reduces high-speed signal loss, and ceramic substrate improves heat dissipation efficiency by .
Breakthrough in localization
Jieduobang and other manufacturers have mastered the alignment accuracy of 16 layer boards ± 25 μ m, and high-frequency mixed pressure plates replace imported ones.
green manufacturing
Lead free tin spraying, wastewater recycling technology to reduce pollution, and research and development of biodegradable substrates
1、 Core process technology
Multi layer PCB manufacturing integrates precision materials science and microfabrication technology, with the core process as follows:
Inner layer graphic production
Pattern transfer: Apply a photosensitive dry film on a copper-clad substrate, form a circuit pattern through exposure and development, and then etch to remove excess copper foil .
Browning treatment: Micro etching the copper surface to generate an oxide layer, enhancing interlayer bonding and preventing high-temperature delamination (plate explosion).
Lamination process
Stack the inner layer board, semi cured sheet (prepreg), and copper foil according to the design, and vacuum hot press at 180-200 ℃ and 200-400psi pressure for 60-90 minutes to ensure uniform resin flow without bubbles.
Drilling and hole metallization
Drilling types: through holes (penetrating the entire board), blind holes (outer to inner layers), buried holes (connecting between inner layers), laser drilling can achieve 0.05mm micro holes of .
Copper electroplating: After chemical deposition of copper seed layer, the entire board is electroplated, and the copper thickness of the hole wall needs to be ≥ 25 μ m to ensure conductivity reliability.
Outer layer wiring and surface treatment
Repeat the graphic transfer process to create the outer circuit, and increase the copper thickness by 5 for graphic electroplating.
Surface treatment: ENIG is used for high-density BGA (gold thickness 0.025-0.127 μ m), while HASL has low cost but poor flatness.
Solder mask and testing
Apply solder mask ink to protect the non welding area, and print the component part number 8 with characters.
Electrical testing (such as flying pin testing) verifies connectivity, and AOI detects visual defects.
Technical difficulties and breakthroughs:
Inter layer alignment: For boards with more than 16 layers, an alignment accuracy of ± 25 μ m is required, relying on high-precision exposure equipment.
Impedance control: The high-speed board requires a tolerance of ± 5%, which can be achieved by adjusting the line width/dielectric thickness to .
High frequency materials: 5G communication adopts Rogers RT/duroid 5880 (Dk=2.2), reducing the loss in the 28GHz frequency band by 40%.
2、 Core advantages and limitations
Advantages:
High density integration
The vertical stacking design reduces wiring area, and the smartphone motherboard integrates processor/memory/sensor through 8-12 layer boards.
Signal integrity optimization
The dedicated layer and power layer suppress EMI, and differential signal wiring reduces crosstalk by 60%, supporting 10Gbps+high-speed transmission (such as PCIe 5.0).
Thermal management and power stability
The power plane reduces impedance and ripple noise can be controlled within 50mV; The heat conduction layer or metal substrate (such as aluminum substrate) improves the heat dissipation efficiency by .
Lightweight and Reliable
Replace multiple single panels, reduce equipment weight (such as aerospace equipment), and enhance vibration resistance with a laminated structure.
Limitations:
High cost: The cost of 8-layer board is 4 times that of double-sided board, due to the material (high-frequency substrate is 5-8 times more expensive) and complex process.
Design threshold: It is necessary to simulate signal integrity, and blind buried hole design increases the difficulty by .
Difficulty in maintenance: Inner layer faults require X-ray or layered testing, with a low success rate of 9% in repair.
3、 Application Fields
Multilayer PCBs are irreplaceable in the high-end electronics field:
Typical product technical requirement cases and performance in application fields
Communication equipment 5G base station antenna/Massive MIMO high-frequency low loss, impedance controlled hybrid board (FR-4+Rogers) achieves 18GHz insertion loss ≤ 0.5dB/inch1
Automotive electronic battery management system (BMS)/millimeter wave radar temperature resistance (-40-125 ℃), anti vibration 10 layer BMS board control ripple<50mV; 77GHz radar accuracy ± 0.1 °
Computing hardware AI server/GPU acceleration card high-density wiring, high-speed signal 12 layer board supporting 10Gbps GPU interconnect
Consumer electronics, smartphones/wearable devices, miniaturization, flexible rigid combination folding screen. The phone adopts an 8-layer rigid flexible combination board
Industrial and medical industrial controllers/endoscopes with high reliability and chemical corrosion resistance. Flexible multi-layer boards for medical probes compatible with curved pipelines
4、 Industry Trends
High density interconnect (HDI) technology
Laser blind hole+Build up process achieves line width/line spacing ≤ 50 μ m, meeting the requirements of chip packaging.
Materials Innovation
Nano filler resin (Dk<3.0) reduces high-speed signal loss, and ceramic substrate improves heat dissipation efficiency by .
Breakthrough in localization
Jieduobang and other manufacturers have mastered the alignment accuracy of 16 layer boards ± 25 μ m, and high-frequency mixed pressure plates replace imported ones.
green manufacturing
Lead free tin spraying, wastewater recycling technology to reduce pollution, and research and development of biodegradable substrates