Factory Customized Strict Testing Multi-layer Circuit Board Manufacturer

1、 Detailed explanation of core process technology
1. High precision lamination and interconnection process
Key technical points of the process, accuracy indicators
Inner layer production core board cutting → LDI laser direct imaging → acid etching → AOI automatic optical detection line width tolerance ± 0.05mm
Stacking of laminated core board and semi cured sheet (PP sheet) → Vacuum hot pressing (180 ℃/400psi) → Cooling and shaping with interlayer offset ≤ 75 μ m
Laser drilling CO ₂/UV laser drilling blind buried hole (aperture 0.1-0.2mm) → plasma slag removal hole position accuracy ± 0.03mm
Chemical deposition of copper through hole metallization (0.3 μ m) → electroplating thickening (hole copper ≥ 25 μ m) → hole filling electroplating (for HDI board) with a depth to diameter ratio ≥ 8:1
Secondary lamination of outer graphic → LDI exposure → graphic electroplating → etching forming impedance control ± 5%
2. Advanced craftsmanship (to meet high-end demands)
Any Layer Interconnect (ELIC):
The entire board adopts laser micro holes (aperture 50 μ m), eliminating through holes to achieve 20+layers of high-density interconnection (mainstream technology for mobile phone motherboards).
Buried resistance and buried capacity:
The inner layer is embedded with resistor/capacitor components (accuracy ± 5%), reducing surface mounting space by 30%.
Mixed pressure technology:
High frequency zone (PTFE)+ordinary zone (FR-4) synchronous compression solves the problem of 5G antenna signal loss (insertion loss<) 0.2dB@10GHz ）.
2、 Core advantage: Dual breakthrough in performance and integration
1. Electrical performance advantages
Comparison of Performance between Multi layer Panels and Single/Double sided Panels
Dedicated reference layer for signal integrity, impedance control ± 5% to reduce crosstalk by 30%, supporting 56Gbps high-speed transmission
EMC Performance Power Supply - Ground Shielding Radiation Passed by Automotive Electronics CISPR 25 Class 5 Standard
The heat dissipation capacity of the inner layer is reduced by 40% using 2oz thick copper as the thermal resistance of the heat channel (with an additional 20% reduction for the aluminum substrate solution)
2. Structural and integration advantages
Space compression:
20 layer HDI board thickness ≤ 1.6mm, saving 70% space compared to double-sided boards (typical value for smartphone motherboards).
High density packaging:
Supports 0.35mm pitch BGA and 01005 micro components, increasing component density by 5 times.
Reliability improvement:
Through 100000 thermal cycles (-55 ℃~150 ℃) and 1000 hours of HAST testing (130 ℃/85% RH).
3、 Application Fields and Typical Cases
1. Communication and computing (accounting for 45%)
Application scenario layers/process technology requirements
5G base station AAU antenna board 12 layer mixed voltage (FR-4+Rogers RO4350B) impedance ± 3%, insertion loss< 0.3dB@28GHz
AI server backplane 16-24 layer high-speed board 112G PAM4 signal, loss<6dB/m
Optical module PCB 8-layer HDI+laser blind hole high temperature resistance (Tg ≥ 170 ℃)
2. Automotive electronics (accounting for 25%)
Application scenario layers/process technology requirements
Autonomous driving domain controller with 8 layers of aluminum substrate and 2 oz thick copper, thermal conductivity of 4.0W/mK, vibration resistance of 20G
800V battery management system 6-layer FR-4+ceramic filling withstand voltage of 3kV, insulation resistance>100G Ω
Vehicle mounted radar 10 layer PTFE high-frequency board phase consistency ± 2 ° @ 77GHz
3. High end consumer electronics (accounting for 20%)
Smartphone: 10 layers of arbitrary HDI (line width/spacing 40 μ m), foldable screen hinge area flexible multi-layer board.
AR/VR devices: 6-layer rigid flex bonding plate (bending radius 3mm), supporting 4K@120Hz Transmission.
4. Special fields
Aerospace: Polyimide multilayer board (radiation resistance>100krad), satellite communication system.
Medical equipment: MRI gradient coil plate (low dielectric loss Df<0.001), ensuring image accuracy.