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Factory Customized Strict Testing Multi-layer Circuit Board Manufacturer

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printed circuit board
Material: FR-4
Copper thickness:1OZ
Test: flying needle test
Thickness of the board: 1-1.6mm
Minimum drilling hole: 0.35-0..5mm
Availability:
Quantity:
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  • XRX-102589

  • DGXRX

1、 Detailed explanation of core process technology
1. High precision lamination and interconnection process
Key technical points of the process, accuracy indicators
Inner layer production core board cutting → LDI laser direct imaging → acid etching → AOI automatic optical detection line width tolerance ± 0.05mm
Stacking of laminated core board and semi cured sheet (PP sheet) → Vacuum hot pressing (180 ℃/400psi) → Cooling and shaping with interlayer offset ≤ 75 μ m
Laser drilling CO ₂/UV laser drilling blind buried hole (aperture 0.1-0.2mm) → plasma slag removal hole position accuracy ± 0.03mm
Chemical deposition of copper through hole metallization (0.3 μ m) → electroplating thickening (hole copper ≥ 25 μ m) → hole filling electroplating (for HDI board) with a depth to diameter ratio ≥ 8:1
Secondary lamination of outer graphic → LDI exposure → graphic electroplating → etching forming impedance control ± 5%
2. Advanced craftsmanship (to meet high-end demands)
Any Layer Interconnect (ELIC):
The entire board adopts laser micro holes (aperture 50 μ m), eliminating through holes to achieve 20+layers of high-density interconnection (mainstream technology for mobile phone motherboards).
Buried resistance and buried capacity:
The inner layer is embedded with resistor/capacitor components (accuracy ± 5%), reducing surface mounting space by 30%.
Mixed pressure technology:
High frequency zone (PTFE)+ordinary zone (FR-4) synchronous compression solves the problem of 5G antenna signal loss (insertion loss<) 0.2dB@10GHz ).
2、 Core advantage: Dual breakthrough in performance and integration
1. Electrical performance advantages
Comparison of Performance between Multi layer Panels and Single/Double sided Panels
Dedicated reference layer for signal integrity, impedance control ± 5% to reduce crosstalk by 30%, supporting 56Gbps high-speed transmission
EMC Performance Power Supply - Ground Shielding Radiation Passed by Automotive Electronics CISPR 25 Class 5 Standard
The heat dissipation capacity of the inner layer is reduced by 40% using 2oz thick copper as the thermal resistance of the heat channel (with an additional 20% reduction for the aluminum substrate solution)
2. Structural and integration advantages
Space compression:
20 layer HDI board thickness ≤ 1.6mm, saving 70% space compared to double-sided boards (typical value for smartphone motherboards).
High density packaging:
Supports 0.35mm pitch BGA and 01005 micro components, increasing component density by 5 times.
Reliability improvement:
Through 100000 thermal cycles (-55 ℃~150 ℃) and 1000 hours of HAST testing (130 ℃/85% RH).
3、 Application Fields and Typical Cases
1. Communication and computing (accounting for 45%)
Application scenario layers/process technology requirements
5G base station AAU antenna board 12 layer mixed voltage (FR-4+Rogers RO4350B) impedance ± 3%, insertion loss< 0.3dB@28GHz
AI server backplane 16-24 layer high-speed board 112G PAM4 signal, loss<6dB/m
Optical module PCB 8-layer HDI+laser blind hole high temperature resistance (Tg ≥ 170 ℃)
2. Automotive electronics (accounting for 25%)
Application scenario layers/process technology requirements
Autonomous driving domain controller with 8 layers of aluminum substrate and 2 oz thick copper, thermal conductivity of 4.0W/mK, vibration resistance of 20G
800V battery management system 6-layer FR-4+ceramic filling withstand voltage of 3kV, insulation resistance>100G Ω
Vehicle mounted radar 10 layer PTFE high-frequency board phase consistency ± 2 ° @ 77GHz
3. High end consumer electronics (accounting for 20%)
Smartphone: 10 layers of arbitrary HDI (line width/spacing 40 μ m), foldable screen hinge area flexible multi-layer board.
AR/VR devices: 6-layer rigid flex bonding plate (bending radius 3mm), supporting 4K@120Hz Transmission.
4. Special fields
Aerospace: Polyimide multilayer board (radiation resistance>100krad), satellite communication system.
Medical equipment: MRI gradient coil plate (low dielectric loss Df<0.001), ensuring image accuracy.

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