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XRX-10257
DGXRX
1、 Craftsmanship: High precision lamination and microporous technology
The manufacturing of multi-layer circuit boards involves precision stacking and micro hole processing, and the core process is as follows:
Inner layer processing and graphic transfer
Cutting and drilling: After cutting the substrate (such as FR-4), the circuit pattern is transferred onto the copper foil through laser direct imaging (LDI), and the line width error needs to be controlled within ± 0.05mm.
Etching and development: Chemical etching removes excess copper foil to form an inner circuit, and AOI (automatic optical inspection) is used to ensure no open/short circuit defects.
Lamination and alignment control
Stacked structure: The inner core board and the semi cured sheet (PP sheet) are alternately stacked and vacuum pressed at high temperature (150 ℃) and high pressure (400psi) to eliminate bubbles and achieve a medium thickness uniformity of ± 3%.
Inter layer alignment: The inter layer tolerance should be ≤ 75 microns, and misalignment should be reduced through temperature and humidity control (25 ± 2 ℃) and positioning system to avoid signal distortion.
Drilling and hole metallization
Micro hole processing: CO ₂ laser drilling blind holes (minimum aperture 0.1mm) or mechanical drilling through holes, high-density BGA areas need to control the hole wall spacing to prevent CAF failure (conductive anode wire phenomenon).
Copper electroplating: Chemical deposition of a copper layer (0.3-0.5 μ m), followed by electroplating to thicken it to 25 μ m or more. Blind holes with a depth to diameter ratio greater than 8:1 require oscillation electroplating to ensure conductivity.
Surface treatment and testing
Surface technology: Choose immersion gold (ENIG, solder strength 45MPa), spray tin (HASL, low-cost) or OSP (environmentally friendly lead-free) according to the requirements.
Reliability verification: Flying needle test+AOI full inspection, impedance control tolerance ± 3%~5%, passed 100000 thermal cycle tests.
Process difficulty: Increasing the number of layers leads to wrinkling of the inner layer and the risk of delamination during compression; Thick copper plate drilling tool is prone to breakage; High frequency materials (such as PTFE) require plasma treatment for processing to enhance copper foil adhesion
Key material selection:
High frequency scenario: PTFE is required for frequencies greater than 10GHz, but surface activation treatment is needed to improve copper foil adhesion.
High temperature environment: High Tg resin (Tg>170 ℃) combined with low CTE material to reduce thermal stress
3、 Application areas: high-density and high reliability scenarios
Communication and computing (accounting for 28%)
5G base station: mixed voltage design (FR-4+Rogers), 64 unit antenna board, supporting 56Gbps high-speed interconnection.
AI server: ultra-thin board with more than 20 layers, integrated with multi chip technology of buried resistance and buried capacitance.
Automotive electronics (accounting for 15%)
High voltage platform: Thick copper PCB (8-10 oz) is used for 800V battery management system, with a 40% increase in heat dissipation.
Intelligent driving: The radar control board is made of PTFE substrate, which is resistant to electromagnetic interference.
Consumer electronics (accounting for 35%)
Smartphone: Any layer HDI board (6-stage stacking), line width/spacing 2.5mil, reducing component volume by 50% 68.
Wearable device: Flexible FPC adheres to the curved surface of the human body.
Industrial and Medical
Industrial control: 22F paper substrate resistant to moisture and heat corrosion, used for PLC controller 19.
Medical imaging: Low loss PCB ensures MRI/X-ray machine image accuracy of 3.
Aerospace: Ceramic substrate resistant to cosmic rays, satellite communication system 17.
4、 Core advantage: Dual improvement in performance and efficiency
Electrical performance optimization
Signal integrity: dedicated grounding layer reduces impedance, differential signal equal length wiring reduces crosstalk, and high-frequency insertion loss is reduced by 15%.
Electromagnetic shielding: The adjacent design between the power source and the ground layer absorbs radiation, improving EMC compatibility by 38%.
Space and Cost Efficiency
High density integration: reduces the volume by 70% compared to a single panel, supports stacking of more than 10 layers (such as smartphone HDI board).
Rapid mass production: Automated processes (LDI+AOI) enable urgent sample delivery within 24 hours, with a batch cycle of 5-6 days.
Heat dissipation and reliability
Thermal management: The thermal conductivity of the aluminum substrate is 1.5W/mK, and the temperature drop of the IGBT module is 30% 37.
Environmental adaptability: 94V-0 flame retardant+moisture and heat resistance test (-55 ℃~150 ℃), passed 100000 thermal cycles 14 times.
Sustainability
Halogen free substrates comply with RoHS standards, with an aluminum substrate recovery rate of 80%
1、 Craftsmanship: High precision lamination and microporous technology
The manufacturing of multi-layer circuit boards involves precision stacking and micro hole processing, and the core process is as follows:
Inner layer processing and graphic transfer
Cutting and drilling: After cutting the substrate (such as FR-4), the circuit pattern is transferred onto the copper foil through laser direct imaging (LDI), and the line width error needs to be controlled within ± 0.05mm.
Etching and development: Chemical etching removes excess copper foil to form an inner circuit, and AOI (automatic optical inspection) is used to ensure no open/short circuit defects.
Lamination and alignment control
Stacked structure: The inner core board and the semi cured sheet (PP sheet) are alternately stacked and vacuum pressed at high temperature (150 ℃) and high pressure (400psi) to eliminate bubbles and achieve a medium thickness uniformity of ± 3%.
Inter layer alignment: The inter layer tolerance should be ≤ 75 microns, and misalignment should be reduced through temperature and humidity control (25 ± 2 ℃) and positioning system to avoid signal distortion.
Drilling and hole metallization
Micro hole processing: CO ₂ laser drilling blind holes (minimum aperture 0.1mm) or mechanical drilling through holes, high-density BGA areas need to control the hole wall spacing to prevent CAF failure (conductive anode wire phenomenon).
Copper electroplating: Chemical deposition of a copper layer (0.3-0.5 μ m), followed by electroplating to thicken it to 25 μ m or more. Blind holes with a depth to diameter ratio greater than 8:1 require oscillation electroplating to ensure conductivity.
Surface treatment and testing
Surface technology: Choose immersion gold (ENIG, solder strength 45MPa), spray tin (HASL, low-cost) or OSP (environmentally friendly lead-free) according to the requirements.
Reliability verification: Flying needle test+AOI full inspection, impedance control tolerance ± 3%~5%, passed 100000 thermal cycle tests.
Process difficulty: Increasing the number of layers leads to wrinkling of the inner layer and the risk of delamination during compression; Thick copper plate drilling tool is prone to breakage; High frequency materials (such as PTFE) require plasma treatment for processing to enhance copper foil adhesion
Key material selection:
High frequency scenario: PTFE is required for frequencies greater than 10GHz, but surface activation treatment is needed to improve copper foil adhesion.
High temperature environment: High Tg resin (Tg>170 ℃) combined with low CTE material to reduce thermal stress
3、 Application areas: high-density and high reliability scenarios
Communication and computing (accounting for 28%)
5G base station: mixed voltage design (FR-4+Rogers), 64 unit antenna board, supporting 56Gbps high-speed interconnection.
AI server: ultra-thin board with more than 20 layers, integrated with multi chip technology of buried resistance and buried capacitance.
Automotive electronics (accounting for 15%)
High voltage platform: Thick copper PCB (8-10 oz) is used for 800V battery management system, with a 40% increase in heat dissipation.
Intelligent driving: The radar control board is made of PTFE substrate, which is resistant to electromagnetic interference.
Consumer electronics (accounting for 35%)
Smartphone: Any layer HDI board (6-stage stacking), line width/spacing 2.5mil, reducing component volume by 50% 68.
Wearable device: Flexible FPC adheres to the curved surface of the human body.
Industrial and Medical
Industrial control: 22F paper substrate resistant to moisture and heat corrosion, used for PLC controller 19.
Medical imaging: Low loss PCB ensures MRI/X-ray machine image accuracy of 3.
Aerospace: Ceramic substrate resistant to cosmic rays, satellite communication system 17.
4、 Core advantage: Dual improvement in performance and efficiency
Electrical performance optimization
Signal integrity: dedicated grounding layer reduces impedance, differential signal equal length wiring reduces crosstalk, and high-frequency insertion loss is reduced by 15%.
Electromagnetic shielding: The adjacent design between the power source and the ground layer absorbs radiation, improving EMC compatibility by 38%.
Space and Cost Efficiency
High density integration: reduces the volume by 70% compared to a single panel, supports stacking of more than 10 layers (such as smartphone HDI board).
Rapid mass production: Automated processes (LDI+AOI) enable urgent sample delivery within 24 hours, with a batch cycle of 5-6 days.
Heat dissipation and reliability
Thermal management: The thermal conductivity of the aluminum substrate is 1.5W/mK, and the temperature drop of the IGBT module is 30% 37.
Environmental adaptability: 94V-0 flame retardant+moisture and heat resistance test (-55 ℃~150 ℃), passed 100000 thermal cycles 14 times.
Sustainability
Halogen free substrates comply with RoHS standards, with an aluminum substrate recovery rate of 80%
