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XRX-7683
DGXRX
Process Technology: Evolution of Environmental Protection and Efficiency
1. Traditional etching process (mainstream)
Substrate preparation: commonly used FR-4 glass fiber board, paper substrate (such as 22F) or polyester film, with copper foil pressed on the surface (thickness mostly 1oz/35 μ m).
Graphic transfer: The circuit pattern is transferred onto copper foil through photolithography technology (coating photoresist → UV exposure → development).
Etching and film removal: Acidic etching solution (such as FeCl ∝+HCl) is used to remove the unprotected copper layer, and then NaOH is used to remove the corrosion-resistant film.
Post processing: drilling → solder mask printing (green oil) → silk screen marking → surface treatment (tin spraying/ISP).
2. Innovative die-cutting process (environmentally friendly alternative)
Die cutting instead of etching: Directly stamping and forming circuits on copper foil strips, synchronously die-cutting and punching holes in the insulation layer, and exposing conductive circuits through the holes after hot pressing.
Environmental advantages: Avoiding acid/alkali etching solution pollution, reducing wastewater treatment costs, and increasing yield by over 20%.
Process simplification: Eliminate 5 processes such as exposure/development/etching, and shorten the production cycle by 30%.
3. Key process control points
Etching accuracy: The line width tolerance is ± 0.1mm, and the concentration and temperature of the solution need to be controlled by 7.
Hot pressing parameters: PET/PI substrate pressing temperature 150-180 ℃, pressure 300-400psi.
Reliability testing: including high and low temperature cycling (-40 ℃~125 ℃), wet heat aging (85 ℃/85% RH), and vibration testing.
2、 Application field: Low cost and high reliability scenario dominant
1. Consumer electronics (accounting for 70%)
Home appliance control board: washing machine timer, air conditioning remote control (paper substrate 22F moisture resistant).
Audio equipment: radio, speaker motherboard (single-layer wiring reduces signal crosstalk and ensures pure sound quality).
Simple display devices: calculator, electronic scale (FR-1 substrate cost<$0.5/piece).
2. Industrial control
Sensor module: Temperature/humidity sensor (polyimide substrate with high temperature resistance).
PLC interface board: low complexity I/O control (22F paper substrate recycling rate of 60%, in line with industrial environmental requirements).
3. Emerging fields
LED lighting driver: Aluminum based single panel (thermal conductivity of 1.5W/mK), solving the heat dissipation needs of low-power lamps.
Wearable devices: Flexible single panel (PI film substrate) used for wristbands and straps, fitting the curved surface of the human body.
3、 Core Advantage: Triangle Balance of Cost, Reliability, and Environmental Protection
1. Economic advantages
Low manufacturing cost: less material usage (copper foil is only single-sided), simplified process flow (30-50% lower than double-sided board cost).
Convenient maintenance: intuitive fault location, component replacement without the need for multiple layers of disassembly, reducing maintenance costs by 40%.
2. Performance and reliability
Low failure rate: No interlayer alignment issues, CAF (conductive anode wire) risk approaches zero.
Environmental adaptability: Through 94V-0 flame retardant certification, the paper substrate is resistant to moisture and heat corrosion (industrial PLC lifespan>10 years).
3. Sustainable innovation
Material recycling: Enterprises such as Zhiwen Electronics have established a recycling system with a copper/aluminum recovery rate of over 60%.
Green technology: Promote cyanide free electroplating and water-based ink printing to reduce heavy metal emissions
Process Technology: Evolution of Environmental Protection and Efficiency
1. Traditional etching process (mainstream)
Substrate preparation: commonly used FR-4 glass fiber board, paper substrate (such as 22F) or polyester film, with copper foil pressed on the surface (thickness mostly 1oz/35 μ m).
Graphic transfer: The circuit pattern is transferred onto copper foil through photolithography technology (coating photoresist → UV exposure → development).
Etching and film removal: Acidic etching solution (such as FeCl ∝+HCl) is used to remove the unprotected copper layer, and then NaOH is used to remove the corrosion-resistant film.
Post processing: drilling → solder mask printing (green oil) → silk screen marking → surface treatment (tin spraying/ISP).
2. Innovative die-cutting process (environmentally friendly alternative)
Die cutting instead of etching: Directly stamping and forming circuits on copper foil strips, synchronously die-cutting and punching holes in the insulation layer, and exposing conductive circuits through the holes after hot pressing.
Environmental advantages: Avoiding acid/alkali etching solution pollution, reducing wastewater treatment costs, and increasing yield by over 20%.
Process simplification: Eliminate 5 processes such as exposure/development/etching, and shorten the production cycle by 30%.
3. Key process control points
Etching accuracy: The line width tolerance is ± 0.1mm, and the concentration and temperature of the solution need to be controlled by 7.
Hot pressing parameters: PET/PI substrate pressing temperature 150-180 ℃, pressure 300-400psi.
Reliability testing: including high and low temperature cycling (-40 ℃~125 ℃), wet heat aging (85 ℃/85% RH), and vibration testing.
2、 Application field: Low cost and high reliability scenario dominant
1. Consumer electronics (accounting for 70%)
Home appliance control board: washing machine timer, air conditioning remote control (paper substrate 22F moisture resistant).
Audio equipment: radio, speaker motherboard (single-layer wiring reduces signal crosstalk and ensures pure sound quality).
Simple display devices: calculator, electronic scale (FR-1 substrate cost<$0.5/piece).
2. Industrial control
Sensor module: Temperature/humidity sensor (polyimide substrate with high temperature resistance).
PLC interface board: low complexity I/O control (22F paper substrate recycling rate of 60%, in line with industrial environmental requirements).
3. Emerging fields
LED lighting driver: Aluminum based single panel (thermal conductivity of 1.5W/mK), solving the heat dissipation needs of low-power lamps.
Wearable devices: Flexible single panel (PI film substrate) used for wristbands and straps, fitting the curved surface of the human body.
3、 Core Advantage: Triangle Balance of Cost, Reliability, and Environmental Protection
1. Economic advantages
Low manufacturing cost: less material usage (copper foil is only single-sided), simplified process flow (30-50% lower than double-sided board cost).
Convenient maintenance: intuitive fault location, component replacement without the need for multiple layers of disassembly, reducing maintenance costs by 40%.
2. Performance and reliability
Low failure rate: No interlayer alignment issues, CAF (conductive anode wire) risk approaches zero.
Environmental adaptability: Through 94V-0 flame retardant certification, the paper substrate is resistant to moisture and heat corrosion (industrial PLC lifespan>10 years).
3. Sustainable innovation
Material recycling: Enterprises such as Zhiwen Electronics have established a recycling system with a copper/aluminum recovery rate of over 60%.
Green technology: Promote cyanide free electroplating and water-based ink printing to reduce heavy metal emissions