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XRX-12844
DGXRX
Core production processes of double-sided circuit boards
Base material preparation
Material selection: Commonly used FR-4 (epoxy resin fiber board), thickness 0.8~1.6mm, copper foil thickness 1 oz (35μm) or 0.5 oz (17.μm).
Base material cutting: Cut the copper-clad laminate according to the design size, and grind the edges to avoid burrs.
Dr and hole metallization
Mechanical drilling: Drill through holes (hole diameter ≥0.3mm) to provide channels for interlayer conduction.
Chem plating (PTH): Deposit a conductive copper layer (thickness 20~25μm) on the hole wall to ensure electrical connection.
Doublesided graphic transfer
Dry film lamination: Cover both sides with light-sensitive dry film, and form circuit patterns through UV exposure and development.
Etching: acidic etching to remove excess copper foil, leaving double-sided circuits.
Solder resist and surface treatment
Solder resist layer: Apply green/black ink cover non-soldering areas.
Surface treatment: Optional processes such as HASL (spray tin), ENIG (chemical nickel immersion gold), or O to enhance soldering reliability.
Testing and panel separation
Electrical testing: Flying probe test or fixture test to verify conductivity.
Panel separation: Cut with VCut or milling machine to separate individual circuit boards.
The top five core advantages of double-sided circuit boards
Improved wiring density
Double-sided routing: Supports cross-r, avoiding signal interference caused by jumpers on single-sided boards.
Flexible component layout: Both sides can accommodate SMD components (such as ICs, capacitors, increasing space utilization by 2~3 times.
Optimized electrical performance
Plated-through holes (PTH): Low conduction resistance (<10 mΩ, supporting mid-frequency signals (≤500 MHz).
Localized copper plating: Reduces EMI interference through ground plane design and improves signal integrity.
Balanced cost-effectiveness
Lower cost than multilayer boards: The cost of a double-sided board is approximately 30%~50% of that a 4-layer board, suitable for small to medium-scale production.
Mature process: Standardized process with high yield rate (≥95%), short cycle (3~5 days).
Heat dissipation and reliability
Double-sided heat dissipation: Heating components can be distributed on both sides, dissipating heat copper foil and heat holes.
High mechanical strength: Better resistance to bending than single-sided boards, suitable for vibrating environments (such as automotive electronics).
venient expansion and maintenance
Test points reserved: Debugging interfaces can be set on the back for easy functional verification.
Support for upgrades: Functions can be added through jump or expansion modules without redesigning the PCB.
Core production processes of double-sided circuit boards
Base material preparation
Material selection: Commonly used FR-4 (epoxy resin fiber board), thickness 0.8~1.6mm, copper foil thickness 1 oz (35μm) or 0.5 oz (17.μm).
Base material cutting: Cut the copper-clad laminate according to the design size, and grind the edges to avoid burrs.
Dr and hole metallization
Mechanical drilling: Drill through holes (hole diameter ≥0.3mm) to provide channels for interlayer conduction.
Chem plating (PTH): Deposit a conductive copper layer (thickness 20~25μm) on the hole wall to ensure electrical connection.
Doublesided graphic transfer
Dry film lamination: Cover both sides with light-sensitive dry film, and form circuit patterns through UV exposure and development.
Etching: acidic etching to remove excess copper foil, leaving double-sided circuits.
Solder resist and surface treatment
Solder resist layer: Apply green/black ink cover non-soldering areas.
Surface treatment: Optional processes such as HASL (spray tin), ENIG (chemical nickel immersion gold), or O to enhance soldering reliability.
Testing and panel separation
Electrical testing: Flying probe test or fixture test to verify conductivity.
Panel separation: Cut with VCut or milling machine to separate individual circuit boards.
The top five core advantages of double-sided circuit boards
Improved wiring density
Double-sided routing: Supports cross-r, avoiding signal interference caused by jumpers on single-sided boards.
Flexible component layout: Both sides can accommodate SMD components (such as ICs, capacitors, increasing space utilization by 2~3 times.
Optimized electrical performance
Plated-through holes (PTH): Low conduction resistance (<10 mΩ, supporting mid-frequency signals (≤500 MHz).
Localized copper plating: Reduces EMI interference through ground plane design and improves signal integrity.
Balanced cost-effectiveness
Lower cost than multilayer boards: The cost of a double-sided board is approximately 30%~50% of that a 4-layer board, suitable for small to medium-scale production.
Mature process: Standardized process with high yield rate (≥95%), short cycle (3~5 days).
Heat dissipation and reliability
Double-sided heat dissipation: Heating components can be distributed on both sides, dissipating heat copper foil and heat holes.
High mechanical strength: Better resistance to bending than single-sided boards, suitable for vibrating environments (such as automotive electronics).
venient expansion and maintenance
Test points reserved: Debugging interfaces can be set on the back for easy functional verification.
Support for upgrades: Functions can be added through jump or expansion modules without redesigning the PCB.