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XRX-10275
DGXRX
Core Process Technology
1. Standard Process (Simplified and Efficient)
Process Key Points Precision Control
Material Cutting Cutting of FR-4 epoxy board (Tg≥130℃) with 1oz (35μm) copper foil thickness Size tolerance ±0.2mm
Image Transfer UV exposure and development (or LDI direct imaging) → Covering of circuit with anti-etching Line width tolerance ±0.1mm
Etching and Film Removal Dissolution of copper layer in non-graphic areas with acidic etching (Fe₃) → Removal of anti-etching film with NaOH solution Side etching control ≤15μm
Drilling CNC mechanical drilling (hole ≥0.8mm) → Deburring Hole position precision ±0.1mm
Solder Mask and Characters Screen printing of green solder mask (solder bridge ≥0.1mm) → White character marking Ink thickness 20–25μm
Surface Treatment HASL spray tinlow cost) / OSP anti-oxidation (environmentally friendly lead-free) Tin thickness 1–25μm
2. Points of Process
Halogen-free FR-4: Phosphorus-based flame retardants are used to replace brominated epoxy, complying with RoHS directive (bromine content < 900ppm).
Quick Prototyping: 24-hour delivery (omitting the layer pressing/hole metalization steps),60% faster than multilayer boards.
II. Core Competitive Advantage Analysis
1. Performance Advantages (Compared with other single-layer panel materials)Indicator FR-4 Single-Layer Panel Paper Base Panel (FR-1) Polyester Film
Mechanical Strength Bending strength > 400Pa (twice of paper base panel) Easy to crack (bending < 200MPa) Flexible but lacks rigidity
Heat Resistance g≥130℃, resistant to 288℃ solder impact (10 seconds) Tg≈105℃, prone to delamination high temperatures Heat resistance only 150℃
Environmental Stability Water absorption rate < 0.1%, resistant to 85℃/85 RH humidity Water absorption rate > 0.5%, prone to expansion in humid environments Good resistance to chemical corrosion but high water absorption
Electrical Properties D=4.5@1MHz, suitable for circuits below 100MHz Dk>5.0, large high-frequency loss Dk≈3.2 susceptible to electrostatic breakdown
2. Economic Advantages
50% lower cost than multilayer boards: Omitting processes such as inner layer pressing/blind holes, material utilization rate 90%.
Extremely low maintenance costs: No risk of interlayer short circuits, fault location time < 3 minutes.
III. Application Fields andical Cases
1. Industrial Control (40% of total)
Application Scenario Design Points Performance Requirements
PLC Relay Module 1oz copper thickness OSP treatment Withstand 100,000 plug-ins, lifespan > 10 years
Temperature and Humidity Sensor Simplified large area grounding Operating temperature -40℃~85℃
Motor Control Interface 2oz local thick copper (current > 5A) stand ESD 8kV (IEC 61000-4-2)
2. Consumer Electronics (35% of total)
Home appliance board:
Air conditioner remote control (single-key circuit, cost < $0.2/piece)
Rice cooker timer (resistant to steam corrosion, FR4 has excellent humidity resistance)
LED Lighting:
Spherical LED driver board (non-isolated solution, no heat sink required)
3. Automotive (15% of total)
Low-voltage system: Window lift switch, seat heating controller (FR-4 Tg150℃ version)
On-boardories: USB charging module (OSP surface treatment for anti-oxidation)
4. Emerging Fields
IoT terminal:
LoRa Node Sensorsingle-sided panel postage stamp hole design, power consumption < 1W)
Educational Kits:
Electronic building block base (FR- resistant to repeated welding by students)
IV. Limitations and Solutions
Defect Countermeasure Effect
Low wiring density Use jumpers or 0 resistors to bridge Increase 30% wiring flexibility
Core Process Technology
1. Standard Process (Simplified and Efficient)
Process Key Points Precision Control
Material Cutting Cutting of FR-4 epoxy board (Tg≥130℃) with 1oz (35μm) copper foil thickness Size tolerance ±0.2mm
Image Transfer UV exposure and development (or LDI direct imaging) → Covering of circuit with anti-etching Line width tolerance ±0.1mm
Etching and Film Removal Dissolution of copper layer in non-graphic areas with acidic etching (Fe₃) → Removal of anti-etching film with NaOH solution Side etching control ≤15μm
Drilling CNC mechanical drilling (hole ≥0.8mm) → Deburring Hole position precision ±0.1mm
Solder Mask and Characters Screen printing of green solder mask (solder bridge ≥0.1mm) → White character marking Ink thickness 20–25μm
Surface Treatment HASL spray tinlow cost) / OSP anti-oxidation (environmentally friendly lead-free) Tin thickness 1–25μm
2. Points of Process
Halogen-free FR-4: Phosphorus-based flame retardants are used to replace brominated epoxy, complying with RoHS directive (bromine content < 900ppm).
Quick Prototyping: 24-hour delivery (omitting the layer pressing/hole metalization steps),60% faster than multilayer boards.
II. Core Competitive Advantage Analysis
1. Performance Advantages (Compared with other single-layer panel materials)Indicator FR-4 Single-Layer Panel Paper Base Panel (FR-1) Polyester Film
Mechanical Strength Bending strength > 400Pa (twice of paper base panel) Easy to crack (bending < 200MPa) Flexible but lacks rigidity
Heat Resistance g≥130℃, resistant to 288℃ solder impact (10 seconds) Tg≈105℃, prone to delamination high temperatures Heat resistance only 150℃
Environmental Stability Water absorption rate < 0.1%, resistant to 85℃/85 RH humidity Water absorption rate > 0.5%, prone to expansion in humid environments Good resistance to chemical corrosion but high water absorption
Electrical Properties D=4.5@1MHz, suitable for circuits below 100MHz Dk>5.0, large high-frequency loss Dk≈3.2 susceptible to electrostatic breakdown
2. Economic Advantages
50% lower cost than multilayer boards: Omitting processes such as inner layer pressing/blind holes, material utilization rate 90%.
Extremely low maintenance costs: No risk of interlayer short circuits, fault location time < 3 minutes.
III. Application Fields andical Cases
1. Industrial Control (40% of total)
Application Scenario Design Points Performance Requirements
PLC Relay Module 1oz copper thickness OSP treatment Withstand 100,000 plug-ins, lifespan > 10 years
Temperature and Humidity Sensor Simplified large area grounding Operating temperature -40℃~85℃
Motor Control Interface 2oz local thick copper (current > 5A) stand ESD 8kV (IEC 61000-4-2)
2. Consumer Electronics (35% of total)
Home appliance board:
Air conditioner remote control (single-key circuit, cost < $0.2/piece)
Rice cooker timer (resistant to steam corrosion, FR4 has excellent humidity resistance)
LED Lighting:
Spherical LED driver board (non-isolated solution, no heat sink required)
3. Automotive (15% of total)
Low-voltage system: Window lift switch, seat heating controller (FR-4 Tg150℃ version)
On-boardories: USB charging module (OSP surface treatment for anti-oxidation)
4. Emerging Fields
IoT terminal:
LoRa Node Sensorsingle-sided panel postage stamp hole design, power consumption < 1W)
Educational Kits:
Electronic building block base (FR- resistant to repeated welding by students)
IV. Limitations and Solutions
Defect Countermeasure Effect
Low wiring density Use jumpers or 0 resistors to bridge Increase 30% wiring flexibility