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XRX-12850
DGXRX
PCB Core Process Technology
The PCB manufacturing process is complex, involving multiple links of precision control, and the key technologies include:
Circuit Forming Process
Subtractive method (mainstream process): Excess copper foil is removed from the copper-clad laminate through photolithography andching to form circuit patterns, suitable for high-precision multilayer boards.
Additive/Semi-additive method: Circuits are formed through chemical deposition of copper suitable for high-density interconnect (HDI) boards, with line width/pitch reaching 0.05mm, meeting the needs of miniaturization.
pressing and drilling technology
Vacuum lamination process is adopted for multilayer boards to ensure no bubbles between layers; Laser blind buried hole technology (with a minimum hole diameter 0.07mm) supports 26 layers of high multilayer boards, passing 100,000 thermal cycle tests.
Impedance tolerance ±3% ~ 5%, using TDR dynamic monitoring to ensure the integrity of high-speed signals (such as 5G base stations, AI servers).
Surface treatment process
HASL (Hot Air Solder Leveling): Low cost, suitable for consumer electronics; ENIG (Electroless Nickel Immersion Gold High solder point strength (45MPa), corrosion resistance, used for BGA packaging.
OSP (Organic Solderability Preservative): Environmentally lead-free, suitable for flexible boards (FPC).
Testing and precision control
AI vision alignment system (such as WiseAlign) achieves ±0.0mm alignment accuracy, positioning completed within 0.4 seconds; Flying needle test Automated optical inspection (AOI) ensures a yield rate of >99.95.
PCB Core Advantages
Design and Production Advantages
Standardization and High Integration: Support repeatable graphic design, reduce wiring errors; HD technology achieves high-density stacking above 10 layers, and component volume is reduced by 50%.
Efficient Automated Production: 24-hour prototyping, mass delivery cycle of 5–6 days, and cost reduction of 30% compared to manual wiring.
Performance Reliability Advantages
Signalrity: High-frequency PCB materials reduce transmission loss (5G application insertion loss is reduced by 15%), and impedance control ensures signal distortion-free.
al Adaptability: Metal substrates are resistant to high temperatures (-55℃~150℃), and 94V-0 flame retardant boards pass and dry heat/chemical corrosion tests, suitable for industrial environments.
Sustainability Advantages
Halogen-free base materials (such as Cem1) comply RoHS standards; Aluminum substrate recycling rate reaches 80%, reducing resource consumption.
PCB Core Process Technology
The PCB manufacturing process is complex, involving multiple links of precision control, and the key technologies include:
Circuit Forming Process
Subtractive method (mainstream process): Excess copper foil is removed from the copper-clad laminate through photolithography andching to form circuit patterns, suitable for high-precision multilayer boards.
Additive/Semi-additive method: Circuits are formed through chemical deposition of copper suitable for high-density interconnect (HDI) boards, with line width/pitch reaching 0.05mm, meeting the needs of miniaturization.
pressing and drilling technology
Vacuum lamination process is adopted for multilayer boards to ensure no bubbles between layers; Laser blind buried hole technology (with a minimum hole diameter 0.07mm) supports 26 layers of high multilayer boards, passing 100,000 thermal cycle tests.
Impedance tolerance ±3% ~ 5%, using TDR dynamic monitoring to ensure the integrity of high-speed signals (such as 5G base stations, AI servers).
Surface treatment process
HASL (Hot Air Solder Leveling): Low cost, suitable for consumer electronics; ENIG (Electroless Nickel Immersion Gold High solder point strength (45MPa), corrosion resistance, used for BGA packaging.
OSP (Organic Solderability Preservative): Environmentally lead-free, suitable for flexible boards (FPC).
Testing and precision control
AI vision alignment system (such as WiseAlign) achieves ±0.0mm alignment accuracy, positioning completed within 0.4 seconds; Flying needle test Automated optical inspection (AOI) ensures a yield rate of >99.95.
PCB Core Advantages
Design and Production Advantages
Standardization and High Integration: Support repeatable graphic design, reduce wiring errors; HD technology achieves high-density stacking above 10 layers, and component volume is reduced by 50%.
Efficient Automated Production: 24-hour prototyping, mass delivery cycle of 5–6 days, and cost reduction of 30% compared to manual wiring.
Performance Reliability Advantages
Signalrity: High-frequency PCB materials reduce transmission loss (5G application insertion loss is reduced by 15%), and impedance control ensures signal distortion-free.
al Adaptability: Metal substrates are resistant to high temperatures (-55℃~150℃), and 94V-0 flame retardant boards pass and dry heat/chemical corrosion tests, suitable for industrial environments.
Sustainability Advantages
Halogen-free base materials (such as Cem1) comply RoHS standards; Aluminum substrate recycling rate reaches 80%, reducing resource consumption.