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XRX-10256
DGXRX
The five core advantages of a four layer circuit board
1. Signal integrity optimization
Dedicated reference layer:
The inner layer L2/L3 is usually set as the ground plane (GND) and power plane (PWR) to reduce signal return paths and EMI interference.
Impedance control: By adjusting the line width and dielectric thickness, accurately match the impedance of high-speed signals such as USB and HDMI (such as 90 Ω differential pairs).
2. Improved power stability
Low impedance power distribution:
The power plane (L3) provides a low impedance power supply network, reducing voltage fluctuations, and is suitable for chips with multiple power requirements such as FPGA and MCU.
Power integrity simulation (PI) can optimize the layout of decoupling capacitors and reduce noise.
3. High space utilization rate
3D wiring capability:
Compared to double-sided boards, the wiring density is increased by 2-3 times and can support 0.8mm pitch BGA packaging.
Example: Double sided panels require complex connections with jumper or winding wires, while four layered panels can be directly connected through the inner layer.
4. Controllable cost
Best value for money:
The cost of four layer board is about 50% to 60% of six layer board, which is suitable for scenarios with limited budget but requiring basic multi-layer performance (such as industrial control motherboards).
The standardized process is mature, and the batch production yield is ≥ 95%.
5. Heat dissipation and reliability
Inner copper foil thermal conductivity:
The high current path dissipates heat through the inner copper foil (such as the power layer designed with 2 oz thick copper).
Thermal simulation optimization layout to avoid local overheating (such as adding heat dissipation holes below MOSFETs).
The five core advantages of a four layer circuit board
1. Signal integrity optimization
Dedicated reference layer:
The inner layer L2/L3 is usually set as the ground plane (GND) and power plane (PWR) to reduce signal return paths and EMI interference.
Impedance control: By adjusting the line width and dielectric thickness, accurately match the impedance of high-speed signals such as USB and HDMI (such as 90 Ω differential pairs).
2. Improved power stability
Low impedance power distribution:
The power plane (L3) provides a low impedance power supply network, reducing voltage fluctuations, and is suitable for chips with multiple power requirements such as FPGA and MCU.
Power integrity simulation (PI) can optimize the layout of decoupling capacitors and reduce noise.
3. High space utilization rate
3D wiring capability:
Compared to double-sided boards, the wiring density is increased by 2-3 times and can support 0.8mm pitch BGA packaging.
Example: Double sided panels require complex connections with jumper or winding wires, while four layered panels can be directly connected through the inner layer.
4. Controllable cost
Best value for money:
The cost of four layer board is about 50% to 60% of six layer board, which is suitable for scenarios with limited budget but requiring basic multi-layer performance (such as industrial control motherboards).
The standardized process is mature, and the batch production yield is ≥ 95%.
5. Heat dissipation and reliability
Inner copper foil thermal conductivity:
The high current path dissipates heat through the inner copper foil (such as the power layer designed with 2 oz thick copper).
Thermal simulation optimization layout to avoid local overheating (such as adding heat dissipation holes below MOSFETs).