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XRX-102588
DGXRX
1、 Core process technology
1. Traditional etching process (mainstream process)
Key technical points of steps, precision control
Prepare FR-1/FR-2 paper substrate or FR-4 epoxy board for cutting, with a standard copper foil thickness of 1oz (35 μ m) and a dimensional tolerance of ± 0.2mm
Pattern transfer UV exposure development (LDI direct imaging optional), anti etching ink covering circuit pattern line width tolerance ± 0.1mm
Etching and stripping: Acidic etching solution (FeCl ∝) dissolves the unprotected copper layer → NaOH solution stripping: Etching factor ≥ 3.0 (side etching control)
Drilling and post-processing CNC mechanical drilling (aperture ≥ 0.8mm) → solder mask ink printing (solder bridge) → character silk screen printing → surface treatment (HASL/OSP) hole position accuracy ± 0.05mm
2. Innovative die-cutting process (environmentally friendly alternative)
Process: Copper foil substrate → Precision die-cutting and stamping circuit → Hot pressed insulation layer → Exposed conductive structure
Advantages:
Zero chemical waste: No etching required, reducing heavy metal pollution
Efficiency improvement: Production cycle shortened by 30% (24-hour fast delivery)
Flexible adaptation: Supports PET/PI film substrate (bending radius>5mm)
2、 Material Range and Characteristics
Comparison of substrate types
Material type, structural composition, key performance, cost (yuan/㎡)
Paper substrate, cotton fiber paper+phenolic resin, voltage resistance 3kV, flame retardant 94V-0, water absorption rate ≤ 0.5% 20-30
FR-4 epoxy board glass fiber cloth+epoxy resin Tg ≥ 130 ℃, flexural strength>400MPa, moisture and heat resistance 50-80
Aluminum substrate aluminum plate+thermal insulation layer+copper foil thermal conductivity coefficient 1.5W/mK, supports 10A high current 100-150
Polyester film PET/PI flexible substrate can bend more than 100000 times and has good folding resistance of 40-60
Material selection guide:
Low cost consumer electronics: paper substrate (FR-1)
Industrial environmental resistance requirements: FR-4 epoxy board
LED heat dissipation scenario: aluminum substrate
Wearable devices: Polyester film (PI)
1、 Core process technology
1. Traditional etching process (mainstream process)
Key technical points of steps, precision control
Prepare FR-1/FR-2 paper substrate or FR-4 epoxy board for cutting, with a standard copper foil thickness of 1oz (35 μ m) and a dimensional tolerance of ± 0.2mm
Pattern transfer UV exposure development (LDI direct imaging optional), anti etching ink covering circuit pattern line width tolerance ± 0.1mm
Etching and stripping: Acidic etching solution (FeCl ∝) dissolves the unprotected copper layer → NaOH solution stripping: Etching factor ≥ 3.0 (side etching control)
Drilling and post-processing CNC mechanical drilling (aperture ≥ 0.8mm) → solder mask ink printing (solder bridge) → character silk screen printing → surface treatment (HASL/OSP) hole position accuracy ± 0.05mm
2. Innovative die-cutting process (environmentally friendly alternative)
Process: Copper foil substrate → Precision die-cutting and stamping circuit → Hot pressed insulation layer → Exposed conductive structure
Advantages:
Zero chemical waste: No etching required, reducing heavy metal pollution
Efficiency improvement: Production cycle shortened by 30% (24-hour fast delivery)
Flexible adaptation: Supports PET/PI film substrate (bending radius>5mm)
2、 Material Range and Characteristics
Comparison of substrate types
Material type, structural composition, key performance, cost (yuan/㎡)
Paper substrate, cotton fiber paper+phenolic resin, voltage resistance 3kV, flame retardant 94V-0, water absorption rate ≤ 0.5% 20-30
FR-4 epoxy board glass fiber cloth+epoxy resin Tg ≥ 130 ℃, flexural strength>400MPa, moisture and heat resistance 50-80
Aluminum substrate aluminum plate+thermal insulation layer+copper foil thermal conductivity coefficient 1.5W/mK, supports 10A high current 100-150
Polyester film PET/PI flexible substrate can bend more than 100000 times and has good folding resistance of 40-60
Material selection guide:
Low cost consumer electronics: paper substrate (FR-1)
Industrial environmental resistance requirements: FR-4 epoxy board
LED heat dissipation scenario: aluminum substrate
Wearable devices: Polyester film (PI)