1、 Core process technology
1. Standardized process (efficient and low-cost)
Key technical points of the process, precision control
Cutting of FR-4 epoxy board (Tg ≥ 130 ℃) with a copper foil thickness of 1oz (35 μ m) and a dimensional tolerance of ± 0.2mm
Graphic transfer UV exposure development (or silk screen corrosion-resistant ink) → Anti corrosion layer covering circuit graphic line width tolerance ± 0.1mm
Etching and stripping: Acidic etching (FeCl ∝/H ₂ O ₂) dissolves copper in the non patterned area → NaOH solution stripping side etching ≤ 15 μ m
Drilling CNC mechanical drilling (aperture ≥ 0.8mm) → deburring hole position accuracy ± 0.1mm
Solder mask and character silk screen green solder mask ink (solder bridge ≥ 0.1mm) → white character marking ink thickness 20-25 μ m
Surface treatment: HASL spray tin (low cost)/OSP (environmentally friendly lead-free)/immersion tin (storage resistant) Tin thickness 1-25 μ m
2. Technological innovation points
Halogen free formula: Phosphorus based flame retardant replaces brominated epoxy, with bromine content<900ppm (compliant with RoHS 3.0);
Quick prototyping: 24-hour delivery (eliminating lamination/hole metallization), 60% faster than multi-layer boards;
Thick copper design: Localized 2oz copper foil etching, supporting 5A current (for power module applications).
2、 Core Advantage Analysis
1. Performance comparison (rolled paper substrate)
Advantages of FR-4 Single Panel Paper Substrate (FR-1)
Mechanical strength, flexural strength>400MPa<200MPa (prone to cracking), vibration resistance increased by 100%
Heat resistance Tg ≥ 130 ℃, resistance to 288 ℃ solder impact (10 seconds) Tg ≈ 105 ℃ (high temperature delamination), suitable for lead-free soldering
Environmental stability, water absorption rate<0.1%, resistance to 85 ℃/85% RH humidity and heat for 1000 hours, water absorption rate>0.5% (moisture expansion), industrial scene life>10 years
Electrical performance Dk= 4.5@1MHz The loss factor Df<0.02 Df>0.05 (severe high-frequency attenuation) indicates that signals below 100MHz are more stable
2. Economic advantages
Cost 50% lower than FR-4 multilayer board: material utilization rate>90%, no need for inner layer pressing/blind hole process;
Extremely low maintenance cost: the fault point can be visually located, and the repair time for overhead lines is less than 3 minutes.
3、 Application Fields and Typical Cases
1. Industrial control (accounting for 45%)
Performance requirements for application scenario technical solutions
PLC relay module with 1oz copper thickness and OSP processing, capable of withstanding 100000 insertions and removals (IEC 60664)
Simplified wiring and large-area grounding for temperature and humidity sensors -40 ℃~85 ℃, with a full temperature range accuracy of ± 2%
Motor control interface local 2oz thick copper (current>5A) resistant to ESD 8kV (IEC 61000-4-2)
2. Consumer electronics (accounting for 40%)
Home appliance control board:
Air conditioner remote control (single button circuit, cost<$0.3/piece)
Rice cooker timer (resistant to steam corrosion, passed 1500V withstand voltage test)
LED lighting driver:
Non isolated solution for bulb lamp (aluminum based embedded heat sink, temperature rise<40 ℃)
3. Automotive electronics (accounting for 10%)
Low voltage system: window lift switch, seat heating controller (FR-4 Tg150 ℃ version)
Car accessories: USB charging module (OSP surface treatment anti oxidation)
4. Emerging fields
IoT edge node: LoRa sensor board (single-sided design+stamp hole, power consumption<1W);
Education kit: Electronic building block substrate (resistant to repeated soldering by students).
4、 Limitations and Solutions
Effectiveness of defect response strategies
Low wiring density jumper or 0 Ω resistor jumper increases wiring flexibility by 30%
Low high-frequency performance>100MHz circuit switched to double-sided board to avoid signal distortion (insertion loss> 3dB@100MHz ）
Insufficient heat dissipation, thermal conductivity hole design+local aluminum heat sink embedded with temperature rise and fall of 10-15 ℃ (5W power consumption scenario)
