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Core production advantages
1. Significant cost-effectiveness
Low material cost: Compared to multi-layer boards (4 or more layers), double-sided boards reduce the number of laminates and material layers, and lower the substrate cost by 30% to 50%.
Process simplification: No need for complex lamination alignment and blind hole embedding processes on multi-layer boards, saving processing costs by 20% to 40%.
Applicable scenarios: Suitable for small or medium batch orders with limited budget but requiring double-sided wiring.
2. Design flexibility and performance improvement
Double sided wiring:
The circuit density is 2-3 times higher than that of a single panel, reducing the PCB area (if a single panel requires a 10cm ² circuit, a double-sided board can be compressed to 4-5cm ²).
Support cross routing to avoid signal interference caused by single panel jumpers.
Metallized via (PTH):
By using chemical copper deposition to achieve interlayer conductivity, the resistance is low (typical value<10m Ω), and the reliability far exceeds that of single panel flying wire welding.
Support high-density component layout (such as double-sided pin out for QFP packaged chips).
Core production advantages
1. Significant cost-effectiveness
Low material cost: Compared to multi-layer boards (4 or more layers), double-sided boards reduce the number of laminates and material layers, and lower the substrate cost by 30% to 50%.
Process simplification: No need for complex lamination alignment and blind hole embedding processes on multi-layer boards, saving processing costs by 20% to 40%.
Applicable scenarios: Suitable for small or medium batch orders with limited budget but requiring double-sided wiring.
2. Design flexibility and performance improvement
Double sided wiring:
The circuit density is 2-3 times higher than that of a single panel, reducing the PCB area (if a single panel requires a 10cm ² circuit, a double-sided board can be compressed to 4-5cm ²).
Support cross routing to avoid signal interference caused by single panel jumpers.
Metallized via (PTH):
By using chemical copper deposition to achieve interlayer conductivity, the resistance is low (typical value<10m Ω), and the reliability far exceeds that of single panel flying wire welding.
Support high-density component layout (such as double-sided pin out for QFP packaged chips).