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XRX-1025
DGXRX
Low cost: Simple materials and processes, suitable for large-scale production.
Short manufacturing cycle: fewer processes (no need for multi-layer lamination, blind holes, etc.).
Easy maintenance: The wiring is clear at a glance, making it easy to detect and weld.
Substrate: usually made of insulating materials (such as FR-4 glass fiber, phenolic resin), providing mechanical support.
Conductive layer: Only one side of the substrate is covered with copper foil (thickness about 18-35 μ m), used for etching circuit traces.
Protective layer: Welding mask (green or other colored solder mask) covering non welding areas, silk screen layer indicating component identification
Low cost: Simple materials and processes, suitable for large-scale production.
Short manufacturing cycle: fewer processes (no need for multi-layer lamination, blind holes, etc.).
Easy maintenance: The wiring is clear at a glance, making it easy to detect and weld.
Substrate: usually made of insulating materials (such as FR-4 glass fiber, phenolic resin), providing mechanical support.
Conductive layer: Only one side of the substrate is covered with copper foil (thickness about 18-35 μ m), used for etching circuit traces.
Protective layer: Welding mask (green or other colored solder mask) covering non welding areas, silk screen layer indicating component identification