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XRX-10395
Detailed explanation of process technology
1、 1 Substrate Structure and Manufacturing Process
22F board is an epoxy phenolic paper-based copper-clad laminate, with the following structural layers:
Surface: Alkali free glass cloth impregnated with epoxy phenolic resin (enhanced mechanical strength)
Core layer: cotton fiber paper impregnated with epoxy phenolic resin containing flame retardant (low cost, excellent flame retardancy)
Conductive layer: single-sided coated with 35 μ m electrolytic copper foil (1oz standard)
Graphic transfer: using screen printing instead of LDI exposure, with a line width of ≥ 0.2mm, reducing costs
Etching control: Side etching ≤ 15 μ m to ensure circuit accuracy
Surface treatment:
OSP (organic solder mask): Low cost, effective for 6 months, suitable for consumer electronics
Lead spray tin: resistant to 288 ℃ solder impact (10 seconds), certified by UL94 V-0
2. Key technological breakthroughs
Optimization of glue flow rate:
The traditional process has a glue flow rate of 14kg/ton, which is reduced to 7kg/ton by adjusting the resin formula (adding plasticizers) and controlling the pressing parameters (temperature gradient segmentation) to reduce pit/tear defects
Brittle improvement:
Adding polyurethane elastomer modified resin increases impact resistance by 40%
Rapid prototyping:
Supporting die punching process (minimum aperture 0.8mm), with a 50% higher efficiency than drilling, suitable for mass production of LED light boards
2、 Core Advantage Analysis
1. Economic and efficiency advantages
Indicator 22F Single Panel FR-4 Single Panel Paper Substrate (FR-1)
Board cost 20-30 yuan/㎡ (minimum) 50-80 yuan/㎡ 15-25 yuan/㎡
Urgent production cycle, sample delivery within 12-24 hours, urgent delivery within 24-48 hours, same as 22F but with low strength
Suitable for process stamping (efficiency up to 50%) requires mechanical drilling and is only suitable for simple stamping
The total cost is 30-50% lower than FR-4, and the unit price for bulk orders can be less than $0.2 per piece (such as remote control boards)
2. Performance and reliability
Electrical performance:
Dielectric constant Dk ≈ 4.5@1MHz Meet the circuit requirements below 100MHz
Flame retardant grade UL94 V-0, passed 288 ℃ thermal shock test (no delamination for 10 seconds)
Environmental adaptability:
Resistant to 85% RH humid and hot environment, industrial PLC module lifespan>10 years
Peel strength ≥ 1.5N/mm, better than FR-1 (＜ 1.0N/mm)
3. Sustainable innovation
Material recovery rate>60%: Paper based core material is biodegradable, copper foil recovery rate>90%
Halogen free process: using hydrated alumina instead of brominated flame retardants, in compliance with RoHS directive
3、 Application Fields and Typical Cases
1. Consumer electronics (accounting for 70%)
LED lighting driver:
Bubble lamp/T8 tube substrate (adopted by 70% of global manufacturers), equipped with aluminum heat sink to solve temperature rise
Advantages: Cost less than 50% of FR-4, resistant to wet and hot corrosion
Home appliance control board:
Rice cooker timer, air conditioning remote control (single button circuit design), mold punching process supports monthly production of 20000 square meters
2. Industrial control (accounting for 25%)
Performance requirements for application scenario technical solutions
PLC relay module OSP processing+2oz local thick copper resistant to 100000 insertions and removals
Simplified wiring for temperature and humidity sensors+large-area grounding -40 ℃~85 ℃ for full temperature range operation
3. Automotive electronics (accounting for 5%)
Low voltage system: window switch, seat heating controller (requires high Tg modified resin version)
Limitations: High frequency signals (>100MHz) need to be replaced with FR-4 to avoid signal distortion
4、 Limitations and coping strategies
Effect of defect solution
High frequency loss>100MHz circuit switching to double-sided board reduces insertion loss to<3dB
Weak heat dissipation capability, locally embedded aluminum heat sinks or increased thermal conductivity holes for temperature rise and fall of 10-15 ℃ (5W LED scene)
Low wiring density jumper or 0 Ω resistor jumper increases wiring flexibility by 30%
Detailed explanation of process technology
1、 1 Substrate Structure and Manufacturing Process
22F board is an epoxy phenolic paper-based copper-clad laminate, with the following structural layers:
Surface: Alkali free glass cloth impregnated with epoxy phenolic resin (enhanced mechanical strength)
Core layer: cotton fiber paper impregnated with epoxy phenolic resin containing flame retardant (low cost, excellent flame retardancy)
Conductive layer: single-sided coated with 35 μ m electrolytic copper foil (1oz standard)
Graphic transfer: using screen printing instead of LDI exposure, with a line width of ≥ 0.2mm, reducing costs
Etching control: Side etching ≤ 15 μ m to ensure circuit accuracy
Surface treatment:
OSP (organic solder mask): Low cost, effective for 6 months, suitable for consumer electronics
Lead spray tin: resistant to 288 ℃ solder impact (10 seconds), certified by UL94 V-0
2. Key technological breakthroughs
Optimization of glue flow rate:
The traditional process has a glue flow rate of 14kg/ton, which is reduced to 7kg/ton by adjusting the resin formula (adding plasticizers) and controlling the pressing parameters (temperature gradient segmentation) to reduce pit/tear defects
Brittle improvement:
Adding polyurethane elastomer modified resin increases impact resistance by 40%
Rapid prototyping:
Supporting die punching process (minimum aperture 0.8mm), with a 50% higher efficiency than drilling, suitable for mass production of LED light boards
2、 Core Advantage Analysis
1. Economic and efficiency advantages
Indicator 22F Single Panel FR-4 Single Panel Paper Substrate (FR-1)
Board cost 20-30 yuan/㎡ (minimum) 50-80 yuan/㎡ 15-25 yuan/㎡
Urgent production cycle, sample delivery within 12-24 hours, urgent delivery within 24-48 hours, same as 22F but with low strength
Suitable for process stamping (efficiency up to 50%) requires mechanical drilling and is only suitable for simple stamping
The total cost is 30-50% lower than FR-4, and the unit price for bulk orders can be less than $0.2 per piece (such as remote control boards)
2. Performance and reliability
Electrical performance:
Dielectric constant Dk ≈ 4.5@1MHz Meet the circuit requirements below 100MHz
Flame retardant grade UL94 V-0, passed 288 ℃ thermal shock test (no delamination for 10 seconds)
Environmental adaptability:
Resistant to 85% RH humid and hot environment, industrial PLC module lifespan>10 years
Peel strength ≥ 1.5N/mm, better than FR-1 (＜ 1.0N/mm)
3. Sustainable innovation
Material recovery rate>60%: Paper based core material is biodegradable, copper foil recovery rate>90%
Halogen free process: using hydrated alumina instead of brominated flame retardants, in compliance with RoHS directive
3、 Application Fields and Typical Cases
1. Consumer electronics (accounting for 70%)
LED lighting driver:
Bubble lamp/T8 tube substrate (adopted by 70% of global manufacturers), equipped with aluminum heat sink to solve temperature rise
Advantages: Cost less than 50% of FR-4, resistant to wet and hot corrosion
Home appliance control board:
Rice cooker timer, air conditioning remote control (single button circuit design), mold punching process supports monthly production of 20000 square meters
2. Industrial control (accounting for 25%)
Performance requirements for application scenario technical solutions
PLC relay module OSP processing+2oz local thick copper resistant to 100000 insertions and removals
Simplified wiring for temperature and humidity sensors+large-area grounding -40 ℃~85 ℃ for full temperature range operation
3. Automotive electronics (accounting for 5%)
Low voltage system: window switch, seat heating controller (requires high Tg modified resin version)
Limitations: High frequency signals (>100MHz) need to be replaced with FR-4 to avoid signal distortion
4、 Limitations and coping strategies
Effect of defect solution
High frequency loss>100MHz circuit switching to double-sided board reduces insertion loss to<3dB
Weak heat dissipation capability, locally embedded aluminum heat sinks or increased thermal conductivity holes for temperature rise and fall of 10-15 ℃ (5W LED scene)
Low wiring density jumper or 0 Ω resistor jumper increases wiring flexibility by 30%
