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XRX-7688
DGXRX
Substrate material: insulation layer core
There are two main types of insulation substrates for universal boards, which are suitable for different scenarios:
Phenolic paper substrate (FR-1/FR-2)
Features: The substrate is made of cotton fiber paper impregnated with phenolic resin, with extremely low cost (about 0.03 yuan/cm ²), easy cutting, but low mechanical strength and poor heat resistance (long-term working temperature ≤ 105 ℃).
Applicable scenarios: Low cost and low complexity projects such as student experiments, low-frequency circuits (such as basic digital circuits, LED light control), etc.
Epoxy glass fiber substrate (FR-4)
Features: Glass fiber cloth+epoxy resin, high mechanical strength, good heat resistance (Tg ≥ 130 ℃), strong moisture resistance, high price (about 0.05-0.08 yuan/cm ²).
Applicable scenarios: industrial controllers, high-frequency circuits, prototype boards that require repeated debugging.
Selection suggestion: Students practice selecting paper boards (FR-1); Select epoxy board (FR-4) for industrial grade projects.
2、 Solder plating: conductivity and durability
The surface treatment of solder pads can be divided into two categories, which directly affect the difficulty of soldering and oxidation resistance:
Type Appearance Characteristics Maintenance Requirements Price (100cm ² reference)
Copper plate, golden yellow bare copper, is prone to oxidation and needs to be wiped with alcohol/eraser before welding; Low cost, sealed storage required, regular cleaning 3-4 yuan
Tin plating on the silver white surface of the tin plate has strong oxidation resistance and good welding fluidity; The substrate is harder (with a high proportion of epoxy resin)
Structure type: Wiring flexibility
Divided into two categories based on the solder pad connection method, suitable for different circuit designs:
Single hole plate (independent solder pad)
All pads are independent and require manual fly wire connection.
Advantages: Suitable for regular circuits such as microcontrollers and digital ICs, avoiding false short circuits.
Connected hole plate (multi pad interconnection)
Each column/row pad is pre connected (commonly 2-5 holes).
Advantages: Simplify analog circuits, separate component wiring (such as transistor amplification circuits), and reduce jumper wires
Comprehensive selection suggestions
Recommend material combinations based on application requirements:
Key criteria for recommending substrate coating structure types in scenarios
Student electronic competition (low-cost) paper substrate (FR-1) copper plate single hole board cost<5 yuan/piece, suitable for digital circuits
Industrial sensor prototype epoxy substrate (FR-4) tin plate perforated plate (double perforated) resistant to vibration, moisture and heat
High frequency RF testing of epoxy substrate (FR-4) tin plate single hole plate reduces parasitic capacitance and ensures more stable signal
Limitations and alternative solutions
Although universal boards are flexible, they have obvious limitations:
Poor high-frequency performance: Flywire introduces parasitic inductance, and it is recommended to use customized PCB for signals above 100MHz.
Reliability risk: Manual soldering is prone to virtual soldering, and the failure rate in vibration environments is 3-5 times higher than that of industrial PCBs.
Insufficient heat dissipation: Dense components require external heat sinks, otherwise the temperature rise can exceed 20 ℃.
Alternative solution: For complex projects, a hybrid design of "FR-4 custom PCB+universal board expansion area" can be used to balance cost and performance
Substrate material: insulation layer core
There are two main types of insulation substrates for universal boards, which are suitable for different scenarios:
Phenolic paper substrate (FR-1/FR-2)
Features: The substrate is made of cotton fiber paper impregnated with phenolic resin, with extremely low cost (about 0.03 yuan/cm ²), easy cutting, but low mechanical strength and poor heat resistance (long-term working temperature ≤ 105 ℃).
Applicable scenarios: Low cost and low complexity projects such as student experiments, low-frequency circuits (such as basic digital circuits, LED light control), etc.
Epoxy glass fiber substrate (FR-4)
Features: Glass fiber cloth+epoxy resin, high mechanical strength, good heat resistance (Tg ≥ 130 ℃), strong moisture resistance, high price (about 0.05-0.08 yuan/cm ²).
Applicable scenarios: industrial controllers, high-frequency circuits, prototype boards that require repeated debugging.
Selection suggestion: Students practice selecting paper boards (FR-1); Select epoxy board (FR-4) for industrial grade projects.
2、 Solder plating: conductivity and durability
The surface treatment of solder pads can be divided into two categories, which directly affect the difficulty of soldering and oxidation resistance:
Type Appearance Characteristics Maintenance Requirements Price (100cm ² reference)
Copper plate, golden yellow bare copper, is prone to oxidation and needs to be wiped with alcohol/eraser before welding; Low cost, sealed storage required, regular cleaning 3-4 yuan
Tin plating on the silver white surface of the tin plate has strong oxidation resistance and good welding fluidity; The substrate is harder (with a high proportion of epoxy resin)
Structure type: Wiring flexibility
Divided into two categories based on the solder pad connection method, suitable for different circuit designs:
Single hole plate (independent solder pad)
All pads are independent and require manual fly wire connection.
Advantages: Suitable for regular circuits such as microcontrollers and digital ICs, avoiding false short circuits.
Connected hole plate (multi pad interconnection)
Each column/row pad is pre connected (commonly 2-5 holes).
Advantages: Simplify analog circuits, separate component wiring (such as transistor amplification circuits), and reduce jumper wires
Comprehensive selection suggestions
Recommend material combinations based on application requirements:
Key criteria for recommending substrate coating structure types in scenarios
Student electronic competition (low-cost) paper substrate (FR-1) copper plate single hole board cost<5 yuan/piece, suitable for digital circuits
Industrial sensor prototype epoxy substrate (FR-4) tin plate perforated plate (double perforated) resistant to vibration, moisture and heat
High frequency RF testing of epoxy substrate (FR-4) tin plate single hole plate reduces parasitic capacitance and ensures more stable signal
Limitations and alternative solutions
Although universal boards are flexible, they have obvious limitations:
Poor high-frequency performance: Flywire introduces parasitic inductance, and it is recommended to use customized PCB for signals above 100MHz.
Reliability risk: Manual soldering is prone to virtual soldering, and the failure rate in vibration environments is 3-5 times higher than that of industrial PCBs.
Insufficient heat dissipation: Dense components require external heat sinks, otherwise the temperature rise can exceed 20 ℃.
Alternative solution: For complex projects, a hybrid design of "FR-4 custom PCB+universal board expansion area" can be used to balance cost and performance