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XRX-0251
DGXRX
Production process flow
The production process of universal circuit boards is simplified, with core steps including:
Base material cutting
Cutting the material (such as FR-4) into standard sizes (common sizes are 100×150mm, 200×300mm).
Drilling
Mechanical drilling: Standard hole pitch (2.54mm) array drilling, hole diameter 0.8~1.0mm.
L drilling (for high-end boards): For tiny holes (hole diameter 0.3~0.5mm), with higher precision.
Copper cladding
Single side/double side pressing of copper foil (1 oz or 0.5 oz thickness), some low-cost boards omit this step (requiring users to sold wires themselves).
Surface treatment
OSP (Organic Solderability Preservative): Prevents oxidation, suitable for short-term storage.
ASL (Hot Air Solder Leveling): Enhances soldering performance, but with lower flatness.
Panel separation and packaging
V-Cut cutting into small, or supplying as a whole board.
Production process flow
The production process of universal circuit boards is simplified, with core steps including:
Base material cutting
Cutting the material (such as FR-4) into standard sizes (common sizes are 100×150mm, 200×300mm).
Drilling
Mechanical drilling: Standard hole pitch (2.54mm) array drilling, hole diameter 0.8~1.0mm.
L drilling (for high-end boards): For tiny holes (hole diameter 0.3~0.5mm), with higher precision.
Copper cladding
Single side/double side pressing of copper foil (1 oz or 0.5 oz thickness), some low-cost boards omit this step (requiring users to sold wires themselves).
Surface treatment
OSP (Organic Solderability Preservative): Prevents oxidation, suitable for short-term storage.
ASL (Hot Air Solder Leveling): Enhances soldering performance, but with lower flatness.
Panel separation and packaging
V-Cut cutting into small, or supplying as a whole board.