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CEM-1 single-sided printed circuit board factory custom high quality circuit board applied to consumer electronics

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Plate:CEM-1
Thickness of plate:1.6mm
Minimum hole diameter: 0.35mm
Test: Electrical test
Availability:
Quantity:
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  • XRX-10272

  • DGXRX

Process flow for single-sided PCBs
1. Traditional process flow (based on etching technology) 3
The traditional manufacturing of single-sided PCBs mainly relies on the etching process of copper-clad laminates, which includes:

Pressing: Combining foil with insulating substrate;

Coating photoresist: Covering with photoresist material;

Exposure and development: Curing the photoresist material through exposure and removing the uncured parts;

Etching: Removing the exposed copper layer using an acidic solution such as ferric chloride;

De-co: Removing the protective layer with sodium hydroxide;

Soldermask printing: Protecting non-soldering areas.
Disadvantages: Invol acid/base solutions, causing high pollution, low efficiency, and high cost.

2. Modern improved process flow (die-cutting hot pressing technology) 13
To optimize environmental friendliness and efficiency, the new process employs die-cutting and pressing technology:

Die-cutting insulation layer for holes: Die-cutting holes on-temperature resistant PET/PI film;

Die-cutting copper foil circuit: Cutting circuit patterns on copper foil tape through rotary or flat plate dies;

pressing: Pressing the die-cut insulation layer with copper foil tape, making the circuit parts exposed through the holes;

Multi-layer lamination (optional): Overl multiple circuit layers, drilling holes, and injecting solder paste to conduct interlayer connections;

Base pressing: Pressing with aluminum substrate or glass fiber board through an insulating layer.

Core advantages: No need for etching and development, reducing pollution and improving efficiency.

II. Advantages of single-sided PCBs
Environmentalliness
The modern process avoids the use of acidic etching solutions, reducing wastewater pollution and conforming to the trend of green manufacturing13.

Low cost and efficiency
The die-cutting technology simplifies the process, reduces material waste, and is suitable for large-scale production16.

Simple and reliable structure
Single-layer reduces line crossings, lowers the risk of short circuits, and facilitates maintenance24.

Thin and lightweight design
Only single-sided wiring, thinner thickness, suitable for devices (such as mobile phones, tablets)48.

High adaptability
Supports high-temperature and vibration-resistant designs, suitable for harsh environments like automotive electronics7.

III. Application fields
Consumer electronics

Mobile phones, tablets: Utilizing its thin and lightweight characteristics to save space4;

Small household appliances ( dryers, electric kettles): Meeting simple circuit requirements and reducing costs48.

Automotive electronics

Engine control, airbag system: High-temperature and-resistant design ensures stability27.

Industrial control and instrumentation

Multimeter, thermometer: Achieving signal acquisition and processing, balancing precision and reliability7.

Medical equipment

Glucose meter, blood pressure monitor: Simple circuit structure reduces failure rate and meets medical safety standards48.

Communication IoT

Wireless remote control, smart home devices: Supporting high-frequency signal transmission and small-sized design67.

Emerging fields

Wable devices: Flexible substrate for bending design10;

Electronic artworks: Using circuit patterns to create artistic


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