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XRX-10298
DGXRX
1、 Material characteristics: Low cost advantage of composite substrate
1. Structural composition
Surface layer: Glass fiber cloth (FR-4 material) enhances mechanical strength;
Core layer: cellulose paper or wood pulp paper-based, impregnated with epoxy resin to reduce costs;
Overall characteristics: milky white appearance, flame retardant grade UL94-V0 (equivalent to FR-4).
2. Key performance parameters
Performance indicator CEM-1 performance compared to other substrates
Mechanical strength and flexural strength>300MPa are better than paper substrate (FR-1), but lower than FR-4
Electrical performance, dielectric constant Dk ≈ 4.5@1MHz Equivalent to FR-4, with slightly higher high-frequency losses
Processing support punching (minimum aperture 0.8mm) superior to FR-4, suitable for large-scale stamping forming
The cost is about 20-30 yuan/square meter, which is 30-50% lower than FR-4
3. Limitations
Single panel only: unable to achieve hole metallization (PTH), not suitable for double-sided/multi-layer designs;
Weak heat resistance: standard Tg ≈ 105 ℃, prone to delamination at high temperatures (modified formula needs to be increased to 130 ℃)
Graphic transfer: Screen printing with anti etching ink (line width ≥ 0.2mm), replacing high cost LDI exposure;
Etching control: FeCl ∝ solution dissolves the non patterned copper layer, side etching ≤ 15 μ m;
Surface treatment: OSP (organic solder mask) is the main method, with a cost only one-third of immersion gold and a shelf life of 6 months.
2. Direction of process innovation
High toughness modification: Adding polydimethylsiloxane polyurethane elastomer powder increases impact resistance by 40% (patented technology);
Environmentally friendly punching: Cold punching process replaces mechanical drilling, increasing efficiency by 50%, suitable for mass production of LED light boards
3、 Application area: Low cost and high reliability scenarios
1. Consumer electronics (accounting for 60%)
LED lighting driver board:
Balancing heat dissipation and cost (assisted by aluminum based embedded heat sinks);
Typical cases: bulb lamp, T8 tube substrate (adopted by 70% of global LED manufacturers).
Home appliance control board:
Rice cooker timer, air conditioning remote control (single button circuit cost<$0.2/piece).
2. Industrial control (accounting for 30%)
Performance requirements for application scenario technical solutions
PLC relay module CEM-1+OSP processing can withstand 100000 insertions and removals, with a lifespan of over 10 years
The 2oz local thick copper design of the power monitoring board supports 5A current and temperature rise<45 ℃
3. Automotive electronics (accounting for 10%)
Low voltage system: window switch, seat heating controller (requiring high Tg modified CEM-1);
Sensor interface: Temperature and humidity transmitter (working in the full temperature range of -40 ℃~85 ℃)
1、 Material characteristics: Low cost advantage of composite substrate
1. Structural composition
Surface layer: Glass fiber cloth (FR-4 material) enhances mechanical strength;
Core layer: cellulose paper or wood pulp paper-based, impregnated with epoxy resin to reduce costs;
Overall characteristics: milky white appearance, flame retardant grade UL94-V0 (equivalent to FR-4).
2. Key performance parameters
Performance indicator CEM-1 performance compared to other substrates
Mechanical strength and flexural strength>300MPa are better than paper substrate (FR-1), but lower than FR-4
Electrical performance, dielectric constant Dk ≈ 4.5@1MHz Equivalent to FR-4, with slightly higher high-frequency losses
Processing support punching (minimum aperture 0.8mm) superior to FR-4, suitable for large-scale stamping forming
The cost is about 20-30 yuan/square meter, which is 30-50% lower than FR-4
3. Limitations
Single panel only: unable to achieve hole metallization (PTH), not suitable for double-sided/multi-layer designs;
Weak heat resistance: standard Tg ≈ 105 ℃, prone to delamination at high temperatures (modified formula needs to be increased to 130 ℃)
Graphic transfer: Screen printing with anti etching ink (line width ≥ 0.2mm), replacing high cost LDI exposure;
Etching control: FeCl ∝ solution dissolves the non patterned copper layer, side etching ≤ 15 μ m;
Surface treatment: OSP (organic solder mask) is the main method, with a cost only one-third of immersion gold and a shelf life of 6 months.
2. Direction of process innovation
High toughness modification: Adding polydimethylsiloxane polyurethane elastomer powder increases impact resistance by 40% (patented technology);
Environmentally friendly punching: Cold punching process replaces mechanical drilling, increasing efficiency by 50%, suitable for mass production of LED light boards
3、 Application area: Low cost and high reliability scenarios
1. Consumer electronics (accounting for 60%)
LED lighting driver board:
Balancing heat dissipation and cost (assisted by aluminum based embedded heat sinks);
Typical cases: bulb lamp, T8 tube substrate (adopted by 70% of global LED manufacturers).
Home appliance control board:
Rice cooker timer, air conditioning remote control (single button circuit cost<$0.2/piece).
2. Industrial control (accounting for 30%)
Performance requirements for application scenario technical solutions
PLC relay module CEM-1+OSP processing can withstand 100000 insertions and removals, with a lifespan of over 10 years
The 2oz local thick copper design of the power monitoring board supports 5A current and temperature rise<45 ℃
3. Automotive electronics (accounting for 10%)
Low voltage system: window switch, seat heating controller (requiring high Tg modified CEM-1);
Sensor interface: Temperature and humidity transmitter (working in the full temperature range of -40 ℃~85 ℃)
