Advantages of Multi-Layer PCBs: The Core Pillar of Modern Electronics' Performance LeapIn todays highly interconnected and intelligent era, electronic devices are evolving rapidly towards being lighter, faster, and more powerful. In this progression, the multi-layer printed circuit board (MultiLayer

I. Core Advantages: Breakthroughs in Performance and Integration1. Electrical Performance AdvantagesMultilayer Board PerformanceImprovement Over Single/Double Sided BoardsSignal Integrity Dedicated Power/Ground Layers, Impedance ±5% Reduction of crosstalk by 30%, Supporting 112Gbps TransmissionEMC P

1、 Core process technology1. Precision lamination and interconnection processThe core of multi-layer PCB lies in interlayer alignment and bonding, and key technologies include:Laminated laminateMaterial stacking: The inner core board (copper-clad substrate) and the semi cured sheet (PP sheet) are al