1、 Core process technology1. Standard process (through-hole metallization process)Key technical points of the process, precision requirementsPreparation of FR-4/CEM-3/Aluminum Substrate Cutting → Copper Foil Thickness 1-2oz (35-70 μ m) Size Tolerance ± 0.15mmDrilling CNC mechanical drilling (apertur

Four-Layer Circuit Board (4-Layer)1. Layer StructureTypical stack-up:Layer → Prepreg → GND Layer → Core → PWR Layer → Prepreg → Bottom Layer(Top signal, ground, power, bottom signal). Core AdvantagesCost-effective: Compared to a double-sided board, adding a power/ground layer, the cost is only 50%~6

I. Core Advantages: Breakthroughs in Performance and Integration1. Electrical Performance AdvantagesMultilayer Board PerformanceImprovement Over Single/Double Sided BoardsSignal Integrity Dedicated Power/Ground Layers, Impedance ±5% Reduction of crosstalk by 30%, Supporting 112Gbps TransmissionEMC P