close
Choose Your Site
Global
Social Media
| Quantity: | |
|---|---|
Our UL 94 V-0 double-sided FR-4 PCB is designed for industrial control systems, power electronics, consumer devices, LED equipment, communication products, and other applications that require reliable electrical connections and flame-retardant laminate materials.
Unlike a single-sided circuit board, a double-sided PCB provides copper circuitry on both sides of the substrate. Plated through holes connect the top and bottom copper layers, allowing designers to achieve higher routing flexibility, reduce unnecessary jumper wires, and fit more functions into a compact board layout.
Xinrongxing provides custom double-sided PCB manufacturing, engineering review, component sourcing, SMT assembly, DIP assembly, testing, and finished PCBA delivery. Boards can be manufactured according to customer Gerber files, drawings, BOM requirements, and applicable IPC specifications.
UL 94 V-0-rated FR-4 laminate options
Two conductive copper layers
Reliable plated through-hole connections
1 oz and 2 oz copper options
Lead-free HASL, ENIG, and OSP surface finishes
Custom solder mask and silkscreen colors
Prototype, small-batch, and volume production
DFM review before PCB fabrication
Flying probe and electrical testing
Turnkey SMT and DIP assembly services
Item | Available Specification |
|---|---|
PCB Type | Double-sided rigid PCB |
Number of Layers | 2 layers |
Base Material | UL 94 V-0-rated FR-4 |
Copper Weight | 1 oz or 2 oz; other options upon review |
Copper Thickness | Approximately 35 μm for 1 oz and 70 μm for 2 oz |
Minimum Finished Hole | 0.30 mm, subject to board design |
Hole Position Tolerance | Up to ±0.05 mm, depending on design |
Board Size Tolerance | Up to ±0.15 mm, depending on outline |
Plated Hole Copper | 20 μm or according to project requirements |
Surface Finish | Lead-Free HASL, ENIG, OSP |
Solder Mask | Green standard; other colors available |
Silkscreen | White standard; other colors available |
Electrical Testing | Flying probe or fixture testing |
Quality Requirement | IPC-6012 Class 2 requirements when specified |
Assembly Service | SMT, DIP, mixed assembly and box build |
All final specifications should be confirmed through Gerber review because board size, copper distribution, hole structure, trace spacing, surface finish, and assembly requirements can affect manufacturing capability.
The manufacturing process begins with the selection and cutting of the copper-clad FR-4 laminate. The laminate grade, board thickness, copper weight, glass transition temperature, and flammability requirement are selected according to the operating environment of the finished electronic product.
Using the correct laminate is important for mechanical strength, dimensional stability, electrical insulation, moisture resistance, and long-term product reliability.
CNC drilling equipment creates component holes, mounting holes, and vias according to the Gerber and NC drill files.
After drilling, the board undergoes deburring and desmear treatment. This removes drilling residue from the hole walls and prepares the exposed laminate surface for subsequent copper deposition.
Accurate drilling is especially important for fine-pitch components, dense routing layouts, connectors, and boards with closely positioned vias.
Plated through holes provide the electrical connection between the top and bottom copper layers.
The hole walls first receive a thin electroless copper deposit. Electrolytic copper plating is then used to increase the copper thickness and create a reliable conductive pathway through the board.
Hole copper thickness, plating uniformity, hole diameter, and aspect ratio must be controlled to reduce the risks of open circuits, barrel cracking, and unstable electrical connections.
The circuit pattern is transferred onto both sides of the PCB through imaging and exposure. Unwanted copper is removed during the etching process, leaving the designed traces, pads, and copper areas.
Trace width, spacing, pad dimensions, and copper balance are inspected to confirm that the manufactured circuit matches the customer’s design data.
A solder mask is applied to protect the copper traces from oxidation, contamination, and accidental solder bridging during assembly.
Component references, polarity marks, logos, warning symbols, and other identification information can then be printed through the silkscreen process. Green solder mask and white silkscreen are standard options, while other colors can be provided for customized projects.
The exposed copper pads require a surface finish to protect solderability and provide a suitable contact surface for component assembly.
Available options include:
Lead-Free HASL: A practical and cost-effective finish for general industrial and consumer electronics.
ENIG: Provides a flat surface suitable for fine-pitch components, BGA assembly, and applications requiring improved surface planarity.
OSP: A thin organic protective coating suitable for projects that require a flat copper surface and controlled manufacturing costs.
The correct finish should be selected according to component pitch, storage requirements, assembly temperature, solderability, surface flatness, and end-use conditions.
Resin-filled or plugged vias can be supplied for designs that require improved surface flatness, reduced solder flow into vias, or better support for via-in-pad structures.
This process is commonly evaluated for dense component layouts, BGA packages, power electronics, and selected high-reliability assemblies. It should be specified during the design review stage rather than added after fabrication begins.
A 2 oz copper design can provide increased current-carrying capacity compared with a standard 1 oz construction.
However, copper weight alone does not determine current capability. Trace width, copper thickness, ambient temperature, airflow, board thickness, thermal vias, component layout, and allowable temperature rise must also be considered.
Our engineering team can review the Gerber files and current requirements before production.
Controlled impedance manufacturing is available for suitable double-sided PCB designs.
To evaluate impedance requirements, customers should provide the required impedance value, tolerance, trace geometry, copper thickness, dielectric thickness, and reference plane information. The final stack-up must be confirmed before manufacturing.
Because copper traces are available on both sides of the board, designers can distribute power, signal, and ground connections more efficiently than with a single-sided PCB.
This makes the construction suitable for moderately complex electronic products that do not require a multilayer PCB.
Plated through holes create permanent conductive connections between the two copper layers. They can also support through-hole components and improve routing flexibility around connectors, power devices, and control components.
A two-layer PCB provides more routing capability than a single-sided board while maintaining a simpler stack-up than a multilayer design.
It is therefore commonly selected for products that require dependable performance, reasonable manufacturing costs, and efficient production lead times.
Lead-free HASL, ENIG, and OSP allow engineers to match the board finish to the assembly process, component type, operating environment, storage period, and project budget.
UL 94 V-0 double-sided FR-4 PCBs can be customized for a wide range of electronic applications, including:
Industrial control boards
Power supply control circuits
Smart home devices
Communication modules
Security and monitoring equipment
LED control systems
Consumer electronic products
Battery management and charging circuits
Automotive auxiliary electronics
Test and measurement equipment
Motor and pump control systems
Small appliance control boards
The final material, copper weight, surface finish, testing method, and quality requirement should be selected according to the actual application.
Each double-sided PCB can undergo a controlled inspection process before shipment.
Automated Optical Inspection checks circuit patterns for common defects such as broken traces, short circuits, excess copper, missing features, and incorrect conductor geometry.
Flying probe testing is suitable for prototypes and small production quantities because it does not require a dedicated test fixture.
For larger production batches, fixture-based electrical testing can be used to inspect open and short circuits efficiently.
Hole diameter, hole position, plating quality, and copper thickness can be inspected according to the project specification. Cross-section analysis may also be used for selected projects to evaluate plated hole structure and copper distribution.
Board outline, slot dimensions, hole positions, V-cut depth, routing features, and other mechanical dimensions are checked against the fabrication drawing.
In addition to bare PCB fabrication, Xinrongxing provides complete PCBA manufacturing support.
Our services include:
PCB engineering and DFM review
BOM review and component sourcing
SMT component placement
Through-hole and DIP assembly
Mixed-technology assembly
AOI and X-ray inspection
Functional testing according to customer procedures
Cable, enclosure, and box-build integration
Packaging and delivery of finished assemblies
Combining PCB fabrication and assembly under one supplier helps reduce communication gaps between board manufacturing, component procurement, and assembly production.
To obtain an accurate quotation, please provide:
Gerber files
NC drill files
Board dimensions
Required quantity
Board thickness
Copper weight
Surface finish
Solder mask and silkscreen colors
Electrical testing requirements
Impedance requirements, when applicable
BOM and pick-and-place files for PCBA
Assembly drawings or special inspection requirements
Providing complete manufacturing data allows our engineering team to identify potential production issues and prepare a more accurate quotation.
UL 94 V-0 is a vertical flammability classification for polymeric materials. For a PCB project, it normally refers to the flammability classification of the laminate material rather than a guarantee that the complete assembled electronic product is fireproof.
The laminate grade and UL recognition should be confirmed according to the required board thickness and application.
No. FR-4 describes a glass-reinforced epoxy laminate material family, while UL 94 V-0 describes a flammability classification.
For this product, the correct specification is a double-sided PCB manufactured from an FR-4 laminate that carries the required UL 94 V-0 classification.
A double-sided PCB provides more routing space than a single-sided board while remaining simpler and generally more economical than a multilayer PCB.
It is suitable for control boards, power circuits, consumer devices, communication products, and other moderately complex electronic designs.
Lead-free HASL is suitable for many general-purpose applications. ENIG provides a flatter surface for fine-pitch components and BGA assembly. OSP provides a flat copper surface and can be a cost-effective option for suitable assembly processes.
The correct choice depends on component type, soldering process, storage conditions, reliability requirements, and project budget.
Yes. Xinrongxing can support bare PCB manufacturing, component sourcing, SMT assembly, through-hole assembly, inspection, testing, and finished PCBA delivery.
