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XRX-10524
When evaluating base materials for critical circuitry, fire safety is paramount to preventing catastrophic failures in the field. During the rigorous Vertical burning test: the sample burns for 10 seconds in the, and the self-extinguishing time after the removal of the fire source ≤ 10 seconds, and there is no burning drips to ignite the cotton wool. This exceptional thermal behavior ensures that your end-products mitigate fire risks effectively, providing profound peace of mind for both manufacturers and end-users. Furthermore, our manufacturing process fully supports lead-free soldering workflows. We provide comprehensive technical documentation, including a detailed Data Sheet and RoHS environmental compliance certificates, significantly reducing procurement risks and ensuring your supply chain meets international ecological standards.
To fully understand the superiority of this material, a direct Comparison with other grades: V-1 (self-extinguishing time ≤ 30 seconds), V-2 (allowing drips to ignite wool) is essential. Our FR-1 double-sided PCB substrate strictly adheres to the highest safety margins, making it an exceptionally reliable foundation for complex electronic assemblies where compromise is not an option.
Thanks to these solid safety profiles, this substrate is engineered for highly demanding environments. Prime applications include Automotive electronics (such as ECU control module), industrial power equipment, household appliances (air conditioners, washing machines) other fields with strict fire protection requirements. By incorporating this board into your production line, you ensure strict compliance with global safety directives while maintaining long-term operational integrity.
Consistent signal integrity relies heavily on the dielectric properties of the printed circuit board. Our FR-1 double-sided PCB guarantees a Surface resistivity ≥10⁶ MΩ (remains stable in humid and hot environments), the risk of electric leakage is effectively eliminated even under severe operational fluctuations. The dense surface finish not only feels exceptionally smooth to the touch but acts as an impenetrable barrier against moisture ingress, protecting delicate traces from environmental degradation.
For applications handling substantial power loads, dielectric breakdown is a primary concern that engineers must address. This board delivers a formidable Withstand voltage ≥1000V/mm (1mm thickness), suitable for high-voltage (such as power modules, charging piles) and heavy machinery controllers. This ensures long-term durability without carbon tracking or electrical degradation over years of continuous use.
Signal propagation speed and impedance control are directly influenced by the substrate's permittivity. This material exhibits a highly stable Dielectric constant (Dk): Typical value 4.5~5.5 (1MHz, meeting the needs of most low-frequency to medium-frequency circuits. This predictable electrical behavior allows hardware engineers to design with absolute confidence. To complement these electrical characteristics, the board comes standard with premium-grade 1oz copper foil. The superior adhesion between the copper layer and the dielectric base ensures high-resolution routing precision and a highly stable current-carrying capacity, preventing delamination during intense thermal cycling.
Physical durability is essential for automated assembly lines and harsh deployment environments where mechanical stress is a daily reality. For context, an FR-4 substrate (V-0 grade) has a bending strength ≥30 MPa, superior to low-end materials such as CEM-1 (250 MPa). Our boards maintain excellent structural rigidity, resisting warping or bowing during component placement. Furthermore, the material is specifically optimized for CNC engraving, photolithography etching, and precise drilling processes. The resulting cuts are perfectly flat and entirely free of burrs, offering a refined tactile experience and making it an ideal choice for rapid prototyping as well as small-to-medium batch production runs.
Thermal management is a critical factor in modern electronics manufacturing, especially as component densities increase. This substrate features a reliable Glass temperature (Tg) ≥130℃, supports lead-free welding processes (peak temperature 260℃). Even when subjected to the intense heat of reflow ovens, the material retains its structural integrity without blistering, outgassing, or emitting harsh chemical odors, ensuring a clean, safe, and highly efficient assembly environment for your factory floor.
Dimensional stability under thermal stress defines the longevity of plated through-holes (PTH) and overall circuit reliability. The board boasts a strictly controlled Coefficient of thermal expansionCTE): CTE ≤14 ppm/℃ on X/Y axes (≤50 ppm/℃ on Z axis), reducing the risk cracking in the walls of holes at high temperatures. It guarantees that the copper plating within the vias remains intact, preserving essential electrical connectivity across the dual layers throughout the product's entire operational lifespan.
