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XRX-100231
DGXRX
High-density integration
Space optimization: By using multilayer routing, the component density is increased by 3-5 times compared to a single- board, such as integrating dozens of chips within a 10cm² area on a mobile phone motherboard.
Signal integrity: By adding ground and power layers, the signal is reduced by 50%, which reduces crosstalk and noise, making it suitable for 5G RF modules.
2. Lightweight and compact sizeWeight reduction: Compared to multiple single-layer boards combined, the weight of a multilayer board is reduced by 30%-50%, which is suitable for aerospace.
Volume compression: Devices like smart bands achieve high integration of sensors and processors through 6-8 layers, reducing volume by 60%.
3. frequency and thermal performance
High-frequency support: An 18-layer board using high-frequency materials (such as Rogers RO4350B) can support 7GHz millimeter-wave radar, with a low dielectric loss (Df) of 0.003.
Thermal design: By embedding metal coressuch as aluminum substrates) or thermal vias, the thermal efficiency is increased by 5 times, which is suitable for high-power LED driving modules
High-density integration
Space optimization: By using multilayer routing, the component density is increased by 3-5 times compared to a single- board, such as integrating dozens of chips within a 10cm² area on a mobile phone motherboard.
Signal integrity: By adding ground and power layers, the signal is reduced by 50%, which reduces crosstalk and noise, making it suitable for 5G RF modules.
2. Lightweight and compact sizeWeight reduction: Compared to multiple single-layer boards combined, the weight of a multilayer board is reduced by 30%-50%, which is suitable for aerospace.
Volume compression: Devices like smart bands achieve high integration of sensors and processors through 6-8 layers, reducing volume by 60%.
3. frequency and thermal performance
High-frequency support: An 18-layer board using high-frequency materials (such as Rogers RO4350B) can support 7GHz millimeter-wave radar, with a low dielectric loss (Df) of 0.003.
Thermal design: By embedding metal coressuch as aluminum substrates) or thermal vias, the thermal efficiency is increased by 5 times, which is suitable for high-power LED driving modules