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XRX-12847
DGXRX
Compared to single panels, it has twice the wiring space, allowing for the design of more complex circuits.
Two sided wiring, combined with via connections, allows for more routing options, making it easier to bypass obstacles and optimize layout.
Usually more space saving than a single panel when achieving the same functionality.
Better signal integrity (compared to single panel): Reasonable stacking and ground plane (partial) design can provide a certain signal loop path, reducing electromagnetic interference (EMI) and crosstalk. Double sided ground wire mesh is a common practice.
High cost-effectiveness: The manufacturing cost is much lower than that of multi-layer boards (4 layers or more) (eliminating complex processes such as lamination and inner layer production), while also meeting more complex circuit requirements than single panel boards, with outstanding cost-effectiveness.
Mature manufacturing process: With a long history of development, the process is very mature and stable, with high yield and relatively short production cycle.
Suitable for medium complexity circuits: It is an ideal bridge between simple single panels and complex multi-layer boards.
Compared to single panels, it has twice the wiring space, allowing for the design of more complex circuits.
Two sided wiring, combined with via connections, allows for more routing options, making it easier to bypass obstacles and optimize layout.
Usually more space saving than a single panel when achieving the same functionality.
Better signal integrity (compared to single panel): Reasonable stacking and ground plane (partial) design can provide a certain signal loop path, reducing electromagnetic interference (EMI) and crosstalk. Double sided ground wire mesh is a common practice.
High cost-effectiveness: The manufacturing cost is much lower than that of multi-layer boards (4 layers or more) (eliminating complex processes such as lamination and inner layer production), while also meeting more complex circuit requirements than single panel boards, with outstanding cost-effectiveness.
Mature manufacturing process: With a long history of development, the process is very mature and stable, with high yield and relatively short production cycle.
Suitable for medium complexity circuits: It is an ideal bridge between simple single panels and complex multi-layer boards.